{ "name": "Semiconductor equipment companies, compared by process step", "url": "https://semiconductorequipmentlist.com/", "license": "CC BY 4.0", "cite": "Semiconductor Equipment List, https://semiconductorequipmentlist.com/", "updated": "2026-11-11", "fields": [ { "key": "step", "label": "Process step", "type": "enum", "description": "The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. \"Several steps\" means three or more.", "filterable": true, "enumValues": [ "Lithography", "Deposition and thermal", "Etch and strip", "Cleaning and CMP", "Ion implantation", "Metrology and inspection", "Test and probing", "Packaging and assembly", "Materials and handling", "Several steps" ] }, { "key": "country", "label": "HQ country", "type": "enum", "description": "Country of the corporate headquarters or principal corporate address stated by the company.", "filterable": true, "enumValues": [ "Austria", "China", "Germany", "Israel", "Japan", "Netherlands", "Singapore", "South Korea", "United Kingdom", "United States" ] }, { "key": "process_steps", "label": "Process steps covered", "type": "string", "description": "Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.", "sortable": false }, { "key": "tool_families", "label": "Tools and product families", "type": "string", "description": "Named equipment models or product families supported by the cited vendor material.", "sortable": false }, { "key": "applications", "label": "Target devices and applications", "type": "string", "description": "Device types, materials or production uses the source states for the tool.", "sortable": false }, { "key": "ai_link", "label": "AI-relevant tools", "type": "bool", "description": "True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.", "filterable": true }, { "key": "ai_relevant_tools", "label": "AI-relevant tools (detail)", "type": "string", "description": "The tool and the AI, HBM or data-center link, as the source states it.", "sortable": false }, { "key": "ai_in_equipment", "label": "AI inside the equipment", "type": "string", "description": "AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.", "sortable": false }, { "key": "wafer_sizes_mm", "label": "Wafer or ingot diameters", "type": "string", "unit": "mm", "description": "Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.", "sortable": false }, { "key": "wavelength_nm", "label": "Operating wavelength", "type": "number", "unit": "nm", "description": "Light wavelength of the named lithography or inspection tool." }, { "key": "resolution", "label": "Patterning resolution", "type": "string", "description": "Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.", "sortable": false }, { "key": "alignment_accuracy", "label": "Alignment, overlay or probing accuracy", "type": "string", "description": "The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.", "sortable": false }, { "key": "throughput", "label": "Rated throughput", "type": "string", "description": "Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.", "sortable": false }, { "key": "technical_capabilities", "label": "Technical capabilities", "type": "string", "description": "Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.", "sortable": false }, { "key": "batch_capacity", "label": "Batch or chamber capacity", "type": "string", "description": "Wafers per batch or process chambers, for the cited model.", "sortable": false }, { "key": "temperature_range", "label": "Process or test temperature", "type": "string", "unit": "°C", "description": "Temperature range or limit for the named equipment, with configuration qualifiers.", "sortable": false }, { "key": "substrate_dimensions", "label": "Substrate or die dimensions", "type": "string", "description": "Model-specific substrate, panel or die dimensions and units.", "sortable": false }, { "key": "inspection_coverage_pct", "label": "Wafer inspection coverage", "type": "number", "unit": "%", "description": "Inspection coverage the vendor states for the named capability. It is not a defect-detection rate." }, { "key": "automation", "label": "Automation and integration", "type": "string", "description": "Material handling, maintenance or factory interfaces supported by the cited model.", "sortable": false }, { "key": "revenue", "label": "Annual revenue", "type": "string", "description": "Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.", "sortable": false }, { "key": "market_share", "label": "Market share or position", "type": "string", "description": "Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.", "sortable": false }, { "key": "market_share_basis", "label": "Market-share basis", "type": "string", "description": "Research provider, measurement basis and period behind the paired market-share figure.", "sortable": false }, { "key": "installed_base", "label": "Installed base or shipments", "type": "string", "description": "Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.", "sortable": false }, { "key": "customer_base", "label": "Customers", "type": "string", "description": "Customer types or named customers in the source.", "sortable": false }, { "key": "commercial_status", "label": "Commercial or corporate status", "type": "string", "description": "Dated product adoption, qualification or pending corporate transaction.", "sortable": false }, { "key": "product_launch", "label": "Product launch", "type": "string", "description": "Dated product announcement or sales launch, with context.", "sortable": false }, { "key": "headquarters", "label": "Headquarters", "type": "string", "description": "Corporate headquarters or principal corporate address as the company states it.", "sortable": false } ], "records": [ { "id": "accretech", "name": "ACCRETECH (Tokyo Seimitsu)", "url": "https://www.accretech.com/", "summary": "Makes wafer probing and dicing equipment for semiconductor manufacturers. Its probing portfolio spans high-performance production probers and specialized systems for memory and smaller wafers.", "hq": "JP", "founded": 1949, "tags": [ "Test" ], "fields": { "process_steps": "Wafer probing and dicing", "step": "Test and probing", "tool_families": "AP3000/AP3000e production probers; UF2000 200 mm prober", "wafer_sizes_mm": "UF2000: 200", "alignment_accuracy": "UF2000 probing precision: ±1.5 µm", "automation": "Prober factory integration supports SEMI GEM E30, CMS E87, PJ E40 and CJ E94", "headquarters": "Japan", "country": "Japan" }, "sources": [ { "url": "https://www.accretech.com/en/assets/companyprofile_E.pdf", "title": "accretech.com / companyprofile E", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "alignment_accuracy", "automation", "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "acm-research", "name": "ACM Research", "url": "https://www.acmr.com/", "summary": "Makes wet-processing and cleaning equipment for semiconductor fabs. Its Ultra C SAPS systems use megasonic cleaning on flat and patterned wafers.", "hq": "US", "tags": [], "fields": { "process_steps": "Single-wafer wet cleaning", "step": "Cleaning and CMP", "tool_families": "Ultra C SAPS II, V and VI", "technical_capabilities": "Space Alternated Phase Shift megasonics distribute cleaning energy across rotating wafers", "throughput": "SAPS VI: up to 800 wafers/hour", "batch_capacity": "SAPS VI: up to 18 chambers", "applications": "Cleaning flat and patterned wafers at advanced nodes", "headquarters": "Fremont, California, United States", "country": "United States", "revenue": "US$901.3 million, 2025" }, "sources": [ { "url": "https://www.acmr.com/tools-and-processes/wet-processing/ultra-c-saps-cleaning/", "title": "acmr.com / ultra c saps cleaning", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "technical_capabilities", "throughput", "batch_capacity", "applications" ] }, { "url": "https://ir.acmr.com/investor-resources/investor-faqs/", "title": "ir.acmr.com / investor faqs", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1680062/000162828026013231/0001628280-26-013231-index.htm", "title": "ACM Research Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "advantest", "name": "Advantest", "url": "https://www.advantest.com/", "summary": "Makes automated semiconductor test systems for chip designers, fabs and test providers. Its scalable V93000 platform tests complex systems on chip, including AI and high-performance computing devices.", "hq": "JP", "founded": 1954, "tags": [ "Test" ], "fields": { "process_steps": "Automated system-on-chip electrical test", "step": "Test and probing", "tool_families": "V93000 EXA Scale", "ai_relevant_tools": "V93000 for AI and high-performance compute devices", "ai_link": true, "technical_capabilities": "EXA Scale accepts existing V93000 Smart Scale load boards and instruments", "customer_base": "IDMs, foundries and design houses", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.advantest.com/en/products/semiconductor-test-system/soc/v93000/", "title": "advantest.com / v93000", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "technical_capabilities", "customer_base" ] }, { "url": "https://www.advantest.com/en/about/overview/", "title": "advantest.com / overview", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "aixtron", "name": "AIXTRON", "url": "https://www.aixtron.com/", "summary": "Makes deposition systems for compound semiconductor manufacturers. Its G10-SiC batch epitaxy reactor targets silicon-carbide power electronics.", "hq": "DE", "tags": [ "Deposition" ], "fields": { "process_steps": "Silicon-carbide epitaxy", "step": "Deposition and thermal", "tool_families": "G10-SiC Planetary Reactor", "wafer_sizes_mm": "G10-SiC: 150 and 200", "batch_capacity": "G10-SiC: nine 150 mm or six 200 mm wafers", "automation": "Fully automated cassette-to-cassette wafer loading", "headquarters": "Herzogenrath, Germany", "country": "Germany" }, "sources": [ { "url": "https://www.aixtron.com/en/products/compound-semiconductors-mocvd/g10-sic", "title": "aixtron.com / g10 sic", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "batch_capacity", "automation" ] }, { "url": "https://aixtron.com/de/service/adressen", "title": "aixtron.com / adressen", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "amec", "name": "AMEC (Advanced Micro-Fabrication Equipment)", "url": "https://www.amec-inc.com/", "summary": "Makes semiconductor etch equipment for chip manufacturers. Its Primo Twin-Star ICP etcher processes conductive and dielectric films for logic, memory, and power devices.", "hq": "CN", "tags": [ "Etch" ], "fields": { "process_steps": "Inductively coupled plasma etch", "step": "Etch and strip", "tool_families": "Primo Twin-Star", "wafer_sizes_mm": "Primo Twin-Star: 300", "technical_capabilities": "Up to three dual-station etch chambers plus two optional integrated strip chambers", "applications": "Silicon structures in CIS/power devices and conductive/dielectric films in logic/DRAM", "headquarters": "Shanghai, China", "country": "China" }, "sources": [ { "url": "https://static.amec-inc.com/uploads/407e00b3b2524132ab7cea10fadf062c.pdf", "title": "static.amec-inc.com / 407e00b3b2524132ab7cea10fadf062c", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "technical_capabilities", "applications" ] }, { "url": "https://static.amec-inc.com/uploads/files/20200928/1601283749765793.pdf", "title": "static.amec-inc.com / 1601283749765793", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "applied-materials", "name": "Applied Materials", "url": "https://www.appliedmaterials.com/", "summary": "Supplies chip fabrication and advanced packaging equipment to logic, memory, and outsourced assembly manufacturers. Its AI-focused products include hybrid bonding, epitaxy, and electron-beam metrology systems.", "hq": "US", "tags": [ "Deposition", "Metrology and inspection", "Advanced packaging and HBM" ], "fields": { "process_steps": "Advanced packaging: die-to-wafer hybrid bonding; epitaxial deposition; eBeam metrology", "step": "Several steps", "tool_families": "Kinex hybrid bonder", "ai_relevant_tools": "Kinex, Xtera and PROVision 10 target GAA logic, HBM and advanced packaging for AI", "ai_link": true, "technical_capabilities": "Centura Xtera: 50% lower gas usage than conventional epitaxy, vendor comparison", "commercial_status": "Kinex used by leading-edge logic, memory and OSAT customers, announced 2025-10-07", "headquarters": "Santa Clara, California, United States", "country": "United States", "revenue": "US$28.37 billion, fiscal 2025 (year to 26 Oct 2025)" }, "sources": [ { "url": "https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-next-gen-chipmaking-products", "title": "ir.appliedmaterials.com / applied materials unveils next gen chipmaking products", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "technical_capabilities", "commercial_status" ] }, { "url": "https://www.appliedmaterials.com/us/en/frequently-asked-questions.html", "title": "appliedmaterials.com / frequently asked questions", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/6951/000162828025056742/0001628280-25-056742-index.htm", "title": "Applied Materials Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "asm-international", "name": "ASM International", "url": "https://www.asm.com/", "summary": "Makes deposition equipment for semiconductor fabs, including atomic layer deposition and epitaxy. Its epitaxy portfolio covers advanced logic and memory devices as well as silicon-carbide processes.", "hq": "NL", "tags": [ "Deposition" ], "fields": { "process_steps": "Epitaxial deposition and surface preclean", "step": "Deposition and thermal", "tool_families": "Intrepid ES and ESA; Epsilon 2000; Previum preclean", "wafer_sizes_mm": "Intrepid ES: 300; Epsilon 2000: 150 and 200", "applications": "Intrepid ES targets advanced transistors and memories", "market_share": "Single-wafer ALD: more than 55% in 2024 (39% in 2018); leading-edge epitaxy: 25% in 2024 (12% in 2020)", "market_share_basis": "ASM internal analysis and TechInsights, Investor Day 2025 (23 Sep 2025)", "headquarters": "Almere, Netherlands", "country": "Netherlands", "revenue": "€3.2 billion, 2025" }, "sources": [ { "url": "https://www.asm.com/our-technology-products/epitaxy", "title": "asm.com / epitaxy", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "applications" ] }, { "url": "https://www.asm.com/media/m3jhkm12/asm_investor_day_2025.pdf", "title": "ASM Investor Day 2025 presentation (23 Sep 2025), slides 8, 9 and 52", "accessed": "2026-11-11", "fields": [ "market_share", "market_share_basis" ] }, { "url": "https://www.asm.com/media/z3ipr1cp/certification-iso-45001-exp-2028.pdf", "title": "asm.com / certification iso 45001 exp 2028", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.asm.com/media/3skhiimk/asm-2025-annual-report.pdf", "title": "ASM 2025 Annual Report", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "asml", "name": "ASML", "url": "https://www.asml.com/", "summary": "Makes lithography systems that pattern wafers for logic and memory chip manufacturers. Its EUV range includes NXE and High NA EXE systems.", "hq": "NL", "tags": [ "Lithography" ], "fields": { "process_steps": "Lithography: EUV wafer patterning", "step": "Lithography", "tool_families": "NXE and EXE EUV systems", "wavelength_nm": 13.5, "resolution": "EXE: 8 nm resolution; numerical aperture 0.55", "ai_relevant_tools": "EUV lithography for chips used in artificial intelligence", "ai_link": true, "headquarters": "Veldhoven, Netherlands", "country": "Netherlands", "revenue": "€32.67 billion, 2025" }, "sources": [ { "url": "https://www.asml.com/en/products/euv-lithography-systems", "title": "asml.com / euv lithography systems", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wavelength_nm", "resolution", "ai_relevant_tools", "ai_link" ] }, { "url": "https://www.asml.com/en/careers/working-at-asml/netherlands", "title": "asml.com / netherlands", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/937966/000162828026011378/0001628280-26-011378-index.htm", "title": "ASML Form 20-F (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "asmpt", "name": "ASMPT", "url": "https://www.asmpt.com/", "summary": "Makes semiconductor assembly equipment including precision die bonders and thermocompression systems. Its AMICRA NANO supports photonic assembly, while its broader packaging portfolio serves AI computing and HBM.", "hq": "SG", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Precision die attach and flip-chip bonding", "step": "Packaging and assembly", "tool_families": "AMICRA NANO", "alignment_accuracy": "AMICRA NANO placement: ±0.2 µm at 3 sigma; performance depends on package and material", "applications": "Photonic assembly and AuSn eutectic bonding", "technical_capabilities": "AMICRA NANO: 300 mm bonding station", "ai_relevant_tools": "TCB systems serve AI data-center packaging; memory-tool decisions linked to HBM4 rollouts (Q3 2026 disclosure)", "ai_link": true, "headquarters": "Singapore", "country": "Singapore" }, "sources": [ { "url": "https://semi.asmpt.com/en/products/ap/ultra-high-precision-die-bonding/amicra-nano/", "title": "semi.asmpt.com / amicra nano", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "alignment_accuracy", "applications", "technical_capabilities" ] }, { "url": "https://www.asmpt.com/site/assets/files/85971/asmpt_q3_2026_investor_presentation.pdf", "title": "asmpt.com / asmpt q3 2026 investor presentation", "accessed": "2026-11-11", "fields": [ "ai_relevant_tools", "ai_link" ] }, { "url": "https://www.asmpt.com/site/assets/files/77022/e_00522ar-20250328.pdf", "title": "asmpt.com / e 00522ar 20250328", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "axcelis-technologies", "name": "Axcelis Technologies", "url": "https://www.axcelis.com/", "summary": "Makes ion implantation systems for semiconductor manufacturers. Its Purion H200 combines high-current implantation with medium-energy processing for silicon and silicon-carbide applications.", "hq": "US", "tags": [], "fields": { "process_steps": "Ion implantation", "step": "Ion implantation", "tool_families": "Purion H200", "technical_capabilities": "Purion H200 implant energy range: 10–230 keV", "wafer_sizes_mm": "Purion H200: silicon 200/300; SiC 150/200", "applications": "Power devices, analog, BCD and mature-node devices", "commercial_status": "Merger with Veeco pending; China SAMR clearance is the only regulatory approval outstanding; close expected by end of Q1 2027 (10-Q filed 2026-11-05)", "headquarters": "Beverly, Massachusetts, United States", "country": "United States", "revenue": "US$839.0 million, 2025" }, "sources": [ { "url": "https://www.axcelis.com/products/medium-energy/", "title": "axcelis.com / medium energy", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "technical_capabilities" ] }, { "url": "https://www.axcelis.com/wp-content/uploads/2023/01/Introducing_the_PurionH200_Single_Wafer_High_Current_Implanter.pdf", "title": "axcelis.com / Introducing the PurionH200 Single Wafer High Current Im", "accessed": "2026-11-11", "fields": [ "wafer_sizes_mm", "applications" ] }, { "url": "https://investor.axcelis.com/news-releases/news-release-details/axcelis-technologies-and-veeco-instruments-provide-update", "title": "investor.axcelis.com / axcelis technologies and veeco instruments provide upda", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1113232/000110465926123333/acls-20260930x10q.htm", "title": "Axcelis Form 10-Q, quarter to 30 Sep 2026 (SEC)", "accessed": "2026-11-11", "fields": [ "commercial_status" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1113232/000110465926020461/0001104659-26-020461-index.htm", "title": "Axcelis Technologies Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "besi", "name": "Besi (BE Semiconductor Industries)", "url": "https://www.besi.com/", "summary": "Makes semiconductor assembly equipment for chip manufacturers and assembly subcontractors. Its Datacon hybrid bonding platform places thin dies for high-density interconnects and 3D integration.", "hq": "NL", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Hybrid die bonding", "step": "Packaging and assembly", "tool_families": "Datacon 8800 CHAMEO ultra plus AC", "alignment_accuracy": "100 nm at 3 sigma, worst-corner glass-on-glass alignment", "throughput": "Up to 2,000 components/hour in dry cycle", "technical_capabilities": "ISO Class 3 atmosphere in working area", "substrate_dimensions": "Die thickness: 25–800 µm", "headquarters": "Duiven, Netherlands", "country": "Netherlands" }, "sources": [ { "url": "https://www.besi.com/products-technology/product-details/product/datacon-8800-chameo-ultra-plus-ac/", "title": "besi.com / datacon 8800 chameo ultra plus ac", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "alignment_accuracy", "throughput", "technical_capabilities", "substrate_dimensions" ] }, { "url": "https://www.besi.com/company/company-profile/", "title": "besi.com / company profile", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "camtek", "name": "Camtek", "url": "https://www.camtek.com/", "summary": "Makes wafer inspection and metrology equipment for advanced packaging and specialty semiconductors. Its Eagle G5 addresses fine-pitch bumps and hybrid-bonding interconnects.", "hq": "IL", "tags": [ "Metrology and inspection", "Advanced packaging and HBM" ], "fields": { "process_steps": "2D inspection and 3D metrology", "step": "Metrology and inspection", "tool_families": "Eagle Generation-5 (Eagle G5)", "applications": "High-performance computing, CMOS image sensors and silicon carbide", "technical_capabilities": "Advanced packaging inspection for fine-pitch microbumps and hybrid-bonding interconnects", "commercial_status": "Orders received for 2025 deliveries; launch announced 2024-09-24", "headquarters": "Migdal Ha'emek, Israel", "country": "Israel", "revenue": "US$496.1 million, 2025" }, "sources": [ { "url": "https://www.camtek.com/news-and-events/camtek-introduced-5th-generation-of-the-eagle-system-supporting-expected-growth-in-2025/", "title": "camtek.com / camtek introduced 5th generation of the eagle system su", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "technical_capabilities", "commercial_status" ] }, { "url": "https://www.camtek.com/contact/headquarters/", "title": "camtek.com / headquarters", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1109138/000117891326001561/0001178913-26-001561-index.htm", "title": "Camtek Form 20-F (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "canon", "name": "Canon", "url": "https://global.canon/", "summary": "Makes semiconductor lithography equipment, including nanoimprint systems. The FPA-1200NZ2C transfers circuit patterns by pressing a patterned mask into resist on a wafer.", "hq": "JP", "founded": 1937, "tags": [ "Lithography" ], "fields": { "process_steps": "Nanoimprint lithography", "step": "Lithography", "tool_families": "FPA-1200NZ2C", "resolution": "FPA-1200NZ2C: minimum linewidth 14 nm", "wafer_sizes_mm": "FPA-1200NZ2C: 300", "alignment_accuracy": "FPA-1200NZ2C: overlay ≤4 nm", "technical_capabilities": "FPA-1200NZ2C field size: 26 × 33 mm", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://global.canon/en/product/indtech/semicon/fpa1200nz2c.html", "title": "global.canon / fpa1200nz2c", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "resolution", "wafer_sizes_mm", "alignment_accuracy", "technical_capabilities" ] }, { "url": "https://global.canon/en/corporate/profile/index.html", "title": "global.canon / profile", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "cohu", "name": "Cohu", "url": "https://www.cohu.com/", "summary": "Makes semiconductor test, handling, inspection, and automation equipment. Its Eclipse handler supports production testing of high-power computing devices with dynamic thermal control.", "hq": "US", "founded": 1947, "tags": [ "Test" ], "fields": { "process_steps": "Final-test handling and automation", "step": "Test and probing", "tool_families": "Eclipse handler", "ai_relevant_tools": "Eclipse for GPUs, CPUs, custom AI accelerators, network processors and ASICs", "ai_link": true, "technical_capabilities": "Precise dynamic thermal control for production test of large HPC devices", "ai_in_equipment": "PAICe Prescriptive software analyzes equipment signals and behavior patterns", "commercial_status": "Fourth HPC customer qualified; announcement dated 2026-11-10", "headquarters": "Poway, California, United States", "country": "United States", "revenue": "US$453.0 million, 2025 (year to 27 Dec 2025)" }, "sources": [ { "url": "https://www.financialcontent.com/article/bizwire-2026-11-10-cohu-eclipse-handler-selected-for-production-test-of-next-generation-high-performance-computing-devices", "title": "Cohu Eclipse handler selected for production test of next-generation HPC devices (Business Wire, 10 Nov 2026)", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "technical_capabilities", "ai_in_equipment", "commercial_status" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/21535/000143774926033843/cohu20260926_10q.htm", "title": "Cohu Form 10-Q, quarter to 26 Sep 2026 (SEC)", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/21535/000143774926004339/0001437749-26-004339-index.htm", "title": "Cohu Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "daifuku", "name": "Daifuku", "url": "https://www.daifuku.com/", "summary": "Makes automated material-handling and storage systems for semiconductor factories. Its Cleanway transports wafer carriers, and its CLW-A7 handles heavy substrates in back-end packaging.", "hq": "JP", "founded": 1937, "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Cleanroom material handling and work-in-progress storage", "step": "Materials and handling", "tool_families": "Cleanway overhead transport", "automation": "Non-contact power supply for FOUP transport reduces abrasion-particle generation", "technical_capabilities": "CLW-A7 handles loads up to 100 kg", "ai_relevant_tools": "CLW-A7 developed for larger panels and heavy loads as AI chiplet packaging advances", "ai_link": true, "headquarters": "Osaka, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.daifuku.com/ir/assets/profile2026_en.pdf", "title": "daifuku.com / profile2026 en", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "automation", "technical_capabilities", "ai_relevant_tools", "ai_link" ] }, { "url": "https://www.daifuku.com/ir/assets/profile2025_en.pdf", "title": "daifuku.com / profile2025 en", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "disco", "name": "DISCO", "url": "https://www.disco.co.jp/", "summary": "Makes precision wafer dicing equipment for semiconductor production. Its DFD6363 fully automatic dicing saw supports 300 mm wafers and multiple cutting processes.", "hq": "JP", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Wafer dicing", "step": "Packaging and assembly", "tool_families": "DFD6363", "wafer_sizes_mm": "DFD6363: up to 300; standard 200 and 300 cassettes supported", "technical_capabilities": "Facing dual spindles; full-cut and half-cut processes", "automation": "Optional automatic blade replacement at end of blade life", "headquarters": "Japan", "country": "Japan" }, "sources": [ { "url": "https://disco.co.jp/eg/products/dicer/dfd6363.html", "title": "disco.co.jp / dfd6363", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "technical_capabilities", "automation" ] }, { "url": "https://athqga01.disco.co.jp/eg/network/japan/index.html", "title": "athqga01.disco.co.jp / japan", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "ebara", "name": "Ebara", "url": "https://www.ebara.com/", "summary": "Makes chemical mechanical polishing and electroplating systems for semiconductor and packaging manufacturers. Its F-REX CMP systems serve R&D and mass production, while UFP supports panel plating.", "hq": "JP", "founded": 1912, "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Chemical mechanical polishing and electroplating", "step": "Cleaning and CMP", "tool_families": "F-REX200M2 and F-REX300X CMP; UFP-AS plating", "wafer_sizes_mm": "F-REX200M2: 200; F-REX300X: 300", "technical_capabilities": "UFP-AS panel size: maximum 600 × 600 mm", "applications": "UFP plating for bumps, redistribution layers and via filling", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.ebara.com/content/dam/ebara/grand-masters/entities/en/products/precision-pump/pdf/80002E_26_6.pdf", "title": "ebara.com / 80002E 26 6", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "technical_capabilities", "applications" ] }, { "url": "https://www.ebara.com/content/dam/ebara/grand-masters/entities/en/ir/library/annual-report/INT25_all_print_EN_1.pdf", "title": "ebara.com / INT25 all print EN 1", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "ev-group", "name": "EV Group", "url": "https://www.evgroup.com/", "summary": "Makes wafer bonding equipment for semiconductor manufacturers and research users. Its GEMINI FB platform integrates alignment and fusion bonding for stacked memory, 3D systems on chip, and image sensors.", "hq": "AT", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Wafer-to-wafer fusion and hybrid bonding", "step": "Packaging and assembly", "tool_families": "GEMINI FB XT", "wafer_sizes_mm": "GEMINI FB: 200 and 300", "alignment_accuracy": "SmartView NT3: wafer-to-wafer alignment below 50 nm", "applications": "Memory stacking, 3D SoCs, stacked backside-illuminated CMOS image sensors and die partitioning", "ai_relevant_tools": "IR LayerRelease transfers ultra-thin silicon layers for 3D integration and AI/HPC chips", "ai_link": true, "headquarters": "Austria", "country": "Austria" }, "sources": [ { "url": "https://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems/gemini-fb", "title": "evgroup.com / gemini fb", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "alignment_accuracy", "applications" ] }, { "url": "https://www.evgroup.com/fileadmin/media/company/news/2026/2026_11_06_Staatspreis_Innovation/Press_Release_EV_Group_StP_Innovation_2026_11_06_EN.pdf", "title": "evgroup.com / Press Release EV Group StP Innovation 2026 11 06 EN", "accessed": "2026-11-11", "fields": [ "ai_relevant_tools", "ai_link", "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "formfactor", "name": "FormFactor", "url": "https://www.formfactor.com/", "summary": "Makes probe systems and test interfaces for semiconductor characterization and production. Its CM300xi supports automated on-wafer measurements across a wide temperature range.", "hq": "US", "tags": [ "Test" ], "fields": { "process_steps": "On-wafer probing and electrical characterization", "step": "Test and probing", "tool_families": "CM300xi semi-/fully automated probe system", "wafer_sizes_mm": "CM300xi: 300; loader handles 200 or 300 mm wafers", "temperature_range": "CM300xi full thermal option: -60°C to +300°C", "applications": "DC, AC and RF/microwave characterization, reliability, failure analysis and design debug", "automation": "Loader handles up to 25 or 50 wafers for unattended operation", "headquarters": "Livermore, California, United States", "country": "United States", "revenue": "US$785.0 million, 2025 (year to 27 Dec 2025)" }, "sources": [ { "url": "https://www.formfactor.com/product/probe-systems/300-mm-systems/cm300xi/", "title": "formfactor.com / cm300xi", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "temperature_range", "applications", "automation" ] }, { "url": "https://investors.formfactor.com/investor-faqs/", "title": "investors.formfactor.com / investor faqs", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1039399/000103939926000009/0001039399-26-000009-index.htm", "title": "FormFactor Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "hanmi-semiconductor", "name": "Hanmi Semiconductor", "url": "https://www.hanmisemi.com/", "summary": "Makes back-end semiconductor equipment including thermocompression bonders, saws, and placement systems. Its HBM TC BONDER line targets stacked memory used in AI semiconductors; product evidence comes from its SEMICON Korea exhibitor profile.", "hq": "KR", "founded": 1980, "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "HBM thermocompression bonding and back-end assembly", "step": "Packaging and assembly", "tool_families": "TC BONDER 4.5 GRIFFIN; TC BONDER 4.0 TIGER", "ai_relevant_tools": "HBM thermocompression bonders for AI semiconductors", "ai_link": true, "market_share": "Claims No.1 global HBM TC bonder position in its SEMICON Korea 2026 profile; percentage/methodology undisclosed", "headquarters": "Incheon, South Korea", "country": "South Korea" }, "sources": [ { "url": "https://expo.semi.org/korea2026/Public/eBooth.aspx?BoothID=634672&IndexInList=186&ListByBooth=true&Nav=False", "title": "expo.semi.org / eBooth", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "market_share", "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "hanwha-semitech", "name": "Hanwha Semitech", "url": "https://www.hanwha.com/companies/hanwha-semitech.do", "summary": "Makes semiconductor back-end bonders, including flip-chip bonders and the SFM5-Expert thermocompression bonder, for IDM and OSAT customers. It added PE-CVD and ALD front-end tools in 2024.", "hq": "KR", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Back-end bonding: flip-chip and thermocompression bonding; PE-CVD and ALD deposition", "step": "Packaging and assembly", "tool_families": "SFM5-Expert thermocompression bonder; flip-chip bonders", "customer_base": "IDM and OSAT customers making memory chips, APs and CPUs", "product_launch": "PE-CVD and ALD front-end equipment introduced in early 2024", "country": "South Korea" }, "sources": [ { "url": "https://www.hanwha.com/companies/hanwha-semitech.do", "title": "Hanwha Semitech company page (hanwha.com)", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "customer_base", "product_launch", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "hitachi-high-tech", "name": "Hitachi High-Tech", "url": "https://www.hitachi-hightech.com/", "summary": "Makes semiconductor metrology equipment for process control in wafer fabs. Its CG7300 critical-dimension SEM measures patterns in EUV-era device production.", "hq": "JP", "tags": [ "Metrology and inspection" ], "fields": { "process_steps": "Critical-dimension SEM metrology", "step": "Metrology and inspection", "tool_families": "CG7300 advanced CD measurement SEM", "applications": "Semiconductor mass production using EUV lithography", "technical_capabilities": "CG7300 improves tool-to-tool matching performance by around 10% versus the previous model", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.hitachi-hightech.com/in/en/products/semiconductor-manufacturing/cd-sem/metrology-solution/semi-cg7300.html", "title": "hitachi-hightech.com / semi cg7300", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "technical_capabilities" ] }, { "url": "https://www.hitachi-hightech.com/global/en/company/location/", "title": "hitachi-hightech.com / location", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "jusung-engineering", "name": "Jusung Engineering", "url": "https://jusung.com/", "summary": "Makes semiconductor thin-film deposition equipment. Its ALD/CVD systems target advanced DRAM, 3D NAND, and logic devices, and its Eureka line provides epitaxy.", "hq": "KR", "tags": [ "Deposition" ], "fields": { "process_steps": "ALD, CVD and epitaxial deposition", "step": "Deposition and thermal", "tool_families": "SDP System; Guidance Series; Eureka", "applications": "Ultra-fine DRAM, 200-plus-layer 3D NAND and sub-10 nm logic", "temperature_range": "Vendor states ALD forms uniform thin films below 300°C", "batch_capacity": "SDP System: five to six wafers simultaneously in one chamber", "technical_capabilities": "Guidance Series adjusts step coverage and film stress", "headquarters": "Gwangju, Gyeonggi-do, South Korea", "country": "South Korea" }, "sources": [ { "url": "https://jusung.com/eng/document/semiconductor", "title": "jusung.com / semiconductor", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "temperature_range", "batch_capacity", "technical_capabilities", "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "kla", "name": "KLA", "url": "https://www.kla.com/", "summary": "Makes semiconductor process-control equipment for detecting defects and improving manufacturing yield. Its systems inspect patterned and unpatterned wafers, and its packaging products inspect and sort assembled devices.", "hq": "US", "tags": [ "Metrology and inspection" ], "fields": { "process_steps": "Wafer defect inspection and inline screening", "step": "Metrology and inspection", "tool_families": "8935 patterned-wafer inspector", "applications": "Automotive chip manufacturing", "ai_in_equipment": "DefectWise AI identifies critical defects during high-volume manufacturing", "technical_capabilities": "I-PAT applies machine learning to identify outlier defect populations", "ai_relevant_tools": "Process-control equipment serves leading-edge foundry/logic, memory and packaging investment associated with AI/HPC", "ai_link": true, "headquarters": "Milpitas, California, United States", "country": "United States", "revenue": "US$13.58 billion, fiscal 2026 (year to 30 Jun 2026)" }, "sources": [ { "url": "https://ir.kla.com/news-events/press-releases/detail/404/kla-launches-new-portfolio-of-automotive-products-to", "title": "ir.kla.com / kla launches new portfolio of automotive products to", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "ai_in_equipment", "technical_capabilities" ] }, { "url": "https://ir.kla.com/sec-filings/all-sec-filings/content/0000319201-26-000027/klac-20260630.htm", "title": "ir.kla.com / klac 20260630", "accessed": "2026-11-11", "fields": [ "ai_relevant_tools", "ai_link" ] }, { "url": "https://ir.kla.com/sec-filings/annual-reports/content/0000319201-26-000027/klac-20260630.htm", "title": "ir.kla.com / klac 20260630", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/319201/000031920126000027/0000319201-26-000027-index.htm", "title": "KLA Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "kokusai-electric", "name": "Kokusai Electric", "url": "https://www.kokusai-electric.com/", "summary": "Makes batch deposition and thermal treatment equipment for semiconductor fabs. Its mini-batch and large-batch platforms form thin films on increasingly complex 3D devices.", "hq": "JP", "tags": [ "Deposition" ], "fields": { "process_steps": "ALD and LP-CVD deposition; oxidation; annealing; diffusion", "step": "Deposition and thermal", "tool_families": "Advanced TSURUGI Plus-III mini-batch deposition platform", "wafer_sizes_mm": "Advanced TSURUGI Plus-III: 300", "applications": "Thin-film processing of complex 3D semiconductor devices", "technical_capabilities": "Advanced TSURUGI uses a compact wafer reactor and high exhaust capacity", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.kokusai-electric.com/en/products", "title": "kokusai-electric.com / products", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "applications", "technical_capabilities" ] }, { "url": "https://www.kokusai-electric.com/en/company/outline/", "title": "kokusai-electric.com / outline", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "kulicke-and-soffa", "name": "Kulicke & Soffa", "url": "https://www.kns.com/", "summary": "Makes semiconductor assembly equipment for chiplet and stacked-die packaging. Its APTURA thermocompression platform supports direct copper-to-copper bonding and development of bumpless chip-to-wafer interconnects.", "hq": "US", "founded": 1951, "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Thermocompression bonding", "step": "Packaging and assembly", "tool_families": "APTURA", "ai_relevant_tools": "Thermocompression chip-to-substrate equipment for AI and HPC chiplets and stacked dies", "ai_link": true, "technical_capabilities": "Direct copper-to-copper bonding is standard on APTURA", "commercial_status": "Bumpless chip-to-wafer hybrid bonding demonstrated with collaborators; announced 2024-08-07", "headquarters": "Fort Washington, Pennsylvania, United States; Singapore", "country": "United States", "revenue": "US$654.1 million, fiscal 2025 (year to 4 Oct 2025)" }, "sources": [ { "url": "https://investor.kns.com/2024-08-07-Kulicke-Soffa-Announces-Thermo-Compression-Adoption-Milestones", "title": "investor.kns.com / 2024 08 07 Kulicke Soffa Announces Thermo Compression A", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "technical_capabilities", "commercial_status" ] }, { "url": "https://www.kns.com/-/media/document/esg/sustainability-report-2024.pdf", "title": "kns.com / sustainability report 2024", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/56978/000005697825000081/0000056978-25-000081-index.htm", "title": "Kulicke & Soffa Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "lam-research", "name": "Lam Research", "url": "https://www.lamresearch.com/", "summary": "Supplies wafer fabrication equipment to semiconductor manufacturers. Its Akara conductor etcher targets advanced transistor and memory structures, and ALTUS Halo deposits molybdenum.", "hq": "US", "tags": [ "Etch" ], "fields": { "process_steps": "Plasma conductor etch", "step": "Etch and strip", "tool_families": "Akara conductor etch", "applications": "Advanced planar DRAM and foundry gate-all-around production", "technical_capabilities": "DirectDrive plasma source: 100 times faster responsiveness than previous sources, vendor comparison", "ai_relevant_tools": "ALTUS Halo molybdenum ALD and Akara conductor etch support AI chip architectures", "ai_link": true, "headquarters": "Fremont, California, United States", "country": "United States", "revenue": "US$23.23 billion, fiscal 2026 (year to 28 Jun 2026)" }, "sources": [ { "url": "https://newsroom.lamresearch.com/2025-02-19-Lam-Research-Unveils-Industrys-Most-Advanced-Conductor-Etch-Technology-to-Date", "title": "newsroom.lamresearch.com / 2025 02 19 Lam Research Unveils Industrys Most Advanced", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "technical_capabilities" ] }, { "url": "https://newsroom.lamresearch.com/lam-wins-again-altus-halo-and-akara-take-gold-and-silver-edison-awards?blog=true", "title": "newsroom.lamresearch.com / lam wins again altus halo and akara take gold and silve", "accessed": "2026-11-11", "fields": [ "ai_relevant_tools", "ai_link" ] }, { "url": "https://www.lamresearch.com/company/locations/", "title": "lamresearch.com / locations", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/707549/000070754926000037/0000707549-26-000037-index.htm", "title": "Lam Research Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "lasertec", "name": "Lasertec", "url": "https://www.lasertec.co.jp/", "summary": "Makes inspection systems for semiconductor masks and wafers. Its ACTIS systems inspect EUV masks using the same wavelength as EUV lithography.", "hq": "JP", "tags": [ "Lithography", "Metrology and inspection" ], "fields": { "process_steps": "EUV patterned-mask inspection", "step": "Metrology and inspection", "tool_families": "ACTIS A150", "wavelength_nm": 13.5, "technical_capabilities": "ACTIS A150 supports through-pellicle inspection", "applications": "EUV mask manufacturing quality assurance and incoming/periodic fab mask inspection", "product_launch": "ACTIS A200HiT series announced 2025-10-31; vendor claims triple A150 inspection speed", "headquarters": "Yokohama, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.lasertec.co.jp/en/products/semiconductor/actis_a150.html", "title": "lasertec.co.jp / actis a150", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wavelength_nm", "technical_capabilities", "applications" ] }, { "url": "https://www.lasertec.co.jp/en/news/20251031_%20ACTIS%20A200HiT%20Series.pdf", "title": "lasertec.co.jp / 20251031 ACTIS A200HiT Series", "accessed": "2026-11-11", "fields": [ "product_launch" ] }, { "url": "https://www.lasertec.co.jp/en/ir/faq.html", "title": "lasertec.co.jp / faq", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "mattson-technology", "name": "Mattson Technology", "url": "https://mattson.com/", "summary": "Makes semiconductor wafer-processing equipment including rapid thermal processing and plasma etch systems. Its Helios RTP systems use double-sided heating for logic, memory, sensor, and other device processes.", "hq": "US", "tags": [ "Deposition" ], "fields": { "process_steps": "Rapid thermal processing and annealing", "step": "Deposition and thermal", "tool_families": "Helios XP and Helios C200", "temperature_range": "Helios XP: 200°C to 1300°C", "applications": "Helios XP: advanced logic, 3D NAND flash and DRAM", "technical_capabilities": "Double-sided wafer heating; two process chambers", "wafer_sizes_mm": "Helios C200: 200", "headquarters": "Fremont, California, United States", "country": "United States" }, "sources": [ { "url": "https://mattson.com/technology/rapid-thermal-processing/", "title": "mattson.com / rapid thermal processing", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "temperature_range", "applications", "technical_capabilities", "wafer_sizes_mm" ] }, { "url": "https://mattson.com/", "title": "mattson.com", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "naura-technology-group", "name": "NAURA Technology Group", "url": "https://www.naura.com/", "summary": "Makes semiconductor process equipment covering etch, deposition, cleaning, furnaces, implantation, and bonding. Its plasma etch portfolio serves integrated circuits, advanced packaging, and compound semiconductors.", "hq": "CN", "tags": [ "Deposition", "Etch", "Advanced packaging and HBM" ], "fields": { "process_steps": "Plasma etch; PVD/CVD deposition; wet processing; bonding; thermal processing; implantation", "step": "Several steps", "tool_families": "NMC 612E ICP etcher; Accura LX dielectric etcher; HSE P300 deep-silicon etcher", "wafer_sizes_mm": "NMC 612E: 12-inch wafers (nominal 300 mm)", "applications": "Integrated circuits, advanced packaging and compound semiconductors", "technical_capabilities": "Etches silicon, deep silicon, metals, dielectrics and compounds including SiC, GaN, GaAs and InP", "headquarters": "Beijing, China", "country": "China" }, "sources": [ { "url": "https://www.naura.com/index.html?l=english", "title": "naura.com / index", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "headquarters", "country" ] }, { "url": "https://www.naura.com/product/details_82_1588.html", "title": "naura.com / details 82 1588", "accessed": "2026-11-11", "fields": [ "tool_families", "wafer_sizes_mm", "applications", "technical_capabilities" ] } ], "verifiedAt": "2026-11-11" }, { "id": "nikon", "name": "Nikon", "url": "https://www.nikon.com/", "summary": "Makes optical lithography systems for semiconductor manufacturers. Its NSR-S636E ArF immersion scanner patterns critical layers and supports 3D device production.", "hq": "JP", "founded": 1917, "tags": [ "Lithography" ], "fields": { "process_steps": "ArF immersion lithography", "step": "Lithography", "tool_families": "NSR-S636E", "resolution": "NSR-S636E: ≤38 nm", "throughput": "NSR-S636E: ≥280 wafers/hour at 96 shots", "alignment_accuracy": "NSR-S636E: ≤2.1 nm mix-and-match overlay between same-model machines", "product_launch": "NSR-S636E sales launch: January 2024", "headquarters": "Tokyo, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.nikon.com/company/news/2023/1206_01/", "title": "nikon.com / 1206 01", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "resolution", "throughput", "alignment_accuracy", "product_launch" ] }, { "url": "https://www.nikon.com/company/corporate/data/", "title": "nikon.com / data", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "nova", "name": "Nova", "url": "https://www.novami.com/", "summary": "Makes semiconductor metrology equipment for process control. Its Prism 2 optical critical-dimension platform addresses advanced logic, memory, and packaging measurements.", "hq": "IL", "tags": [ "Metrology and inspection" ], "fields": { "process_steps": "Optical critical-dimension metrology", "step": "Metrology and inspection", "tool_families": "Nova Prism 2", "technical_capabilities": "Spectral interferometry information channel", "applications": "Advanced memory and logic nodes, plus packaging metrology", "ai_in_equipment": "Machine-learning metrology algorithms", "headquarters": "Rehovot, Israel", "country": "Israel", "revenue": "US$880.6 million, 2025" }, "sources": [ { "url": "https://www.novami.com/wp-content/uploads/2024/03/dmd-all.pdf", "title": "novami.com / dmd all", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "technical_capabilities", "applications", "ai_in_equipment" ] }, { "url": "https://www.novami.com/wp-content/uploads/2025/02/2024form20f-isa.pdf", "title": "novami.com / 2024form20f isa", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1109345/000117891326000504/0001178913-26-000504-index.htm", "title": "Nova Form 20-F (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "onto-innovation", "name": "Onto Innovation", "url": "https://ontoinnovation.com/", "summary": "Makes inspection and metrology systems for semiconductor fabs and advanced packaging manufacturers. Its Dragonfly G3 uses infrared inspection to find hidden defects in bonded and thinned wafers.", "hq": "US", "tags": [ "Metrology and inspection", "Advanced packaging and HBM" ], "fields": { "process_steps": "Advanced packaging inspection and 2D/3D metrology", "step": "Metrology and inspection", "tool_families": "Dragonfly G3", "technical_capabilities": "Infrared subsurface inspection across the entire wafer", "inspection_coverage_pct": 100, "ai_relevant_tools": "Dragonfly G3 supports HBM and advanced logic packaging relevant to AI GPUs", "ai_link": true, "commercial_status": "Multiple orders for the new subsurface capability announced 2024-04-23", "headquarters": "Wilmington, Massachusetts, United States", "country": "United States", "revenue": "US$1.01 billion, 2025 (year to 3 Jan 2026)" }, "sources": [ { "url": "https://investors.ontoinnovation.com/news/news-details/2024/Onto-Innovation-Debuts-Sub-surface-Defect-Inspection-for-Advanced-Packaging/default.aspx", "title": "investors.ontoinnovation.com / Onto Innovation Debuts Sub surface Defect Inspection fo", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "technical_capabilities", "inspection_coverage_pct", "ai_relevant_tools", "ai_link", "commercial_status" ] }, { "url": "https://ontoinnovation.com/contact/", "title": "ontoinnovation.com / contact", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/704532/000119312526066937/0001193125-26-066937-index.htm", "title": "Onto Innovation Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "oxford-instruments-plasma", "name": "Oxford Instruments Plasma Technology", "url": "https://plasma.oxinst.com/", "summary": "Makes plasma process equipment for semiconductor manufacturing. Its PlasmaPro 100 Cobra ICP etcher serves compound-semiconductor, power-device, optoelectronic, MEMS, and sensor applications.", "hq": "GB", "tags": [ "Etch" ], "fields": { "process_steps": "Inductively coupled plasma reactive-ion etch", "step": "Etch and strip", "tool_families": "PlasmaPro 100 Cobra", "wafer_sizes_mm": "PlasmaPro 100 Cobra: up to 200", "temperature_range": "Electrode range: -150°C to +400°C; cooling/heating configuration dependent", "applications": "GaAs/InP optoelectronics; SiC/GaN power and RF; MEMS and sensors", "headquarters": "United Kingdom", "country": "United Kingdom" }, "sources": [ { "url": "https://plasma.oxinst.com/products/icp-etching/plasmapro-100-cobra-icp", "title": "plasma.oxinst.com / plasmapro 100 cobra icp", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "temperature_range", "applications" ] }, { "url": "https://plasma.oxinst.com/service-support/service-blog-and-faqs/trainings-transformative-potential", "title": "plasma.oxinst.com / trainings transformative potential", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "park-systems", "name": "Park Systems", "url": "https://www.parksystems.com/", "summary": "Korean maker of atomic force microscopes. Its NX-Wafer is an automated in-line AFM for 300 mm fabs that runs defect review, CMP profiling and sub-angstrom roughness measurement.", "hq": "KR", "tags": [ "Metrology and inspection" ], "fields": { "process_steps": "In-line atomic force microscopy metrology and automatic defect review", "step": "Metrology and inspection", "tool_families": "Park NX-Wafer automated AFM", "wafer_sizes_mm": "NX-Wafer automatic defect review: 300", "applications": "Automatic defect review and classification; CMP profiling of dishing, erosion and edge-over-erosion; sub-angstrom roughness", "technical_capabilities": "Noise floor below 0.5 Å; XY scan 100 × 100 µm; Z scan 15 µm, 30 µm optional", "automation": "Automatic tip exchange (vendor-stated 99.9% success rate); EFEM or FOUP wafer handler", "country": "South Korea" }, "sources": [ { "url": "https://www.parksystems.com/kr/products/in-line-metrology-afm/wafer-fabrications/nx-wafer", "title": "Park NX-Wafer product page", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "applications", "technical_capabilities", "automation" ] }, { "url": "https://prnewswire.com/news-releases/park-systems-celebrates-groundbreaking-expansion-to-gwacheon-and-yongin-301930294.html", "title": "Park Systems headquarters expansion release (19 Sep 2023)", "accessed": "2026-11-11", "fields": [ "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "piotech", "name": "Piotech", "url": "https://www.piotech.cn/", "summary": "Shenyang-based maker of thin-film deposition tools (PECVD, ALD, SACVD, HDPCVD and flowable CVD) and 3D-integration equipment for wafer-to-wafer and die-to-wafer hybrid bonding.", "hq": "CN", "founded": 2010, "tags": [ "Deposition", "Advanced packaging and HBM" ], "fields": { "process_steps": "PECVD, ALD, SACVD, HDPCVD and flowable CVD gap fill; W2W and D2W hybrid bonding", "step": "Deposition and thermal", "tool_families": "PF-300T and VS-300T Astra PEALD; TS-300 Altair thermal ALD; Dione 300 hybrid bonder; Pleione 300 die-to-wafer fusion bonder", "alignment_accuracy": "Dione 300: post-bond overlay at the hundred-nanometre level", "applications": "Dione 300: high-end memory, advanced logic, backside-illuminated CMOS image sensors, 3D-stacked chips", "customer_base": "Tools in more than 100 production lines across more than 30 provincial-level regions", "headquarters": "Hunnan District, Shenyang, China", "country": "China" }, "sources": [ { "url": "https://www.piotech.cn/index.php/About", "title": "Piotech company profile (piotech.cn, Chinese)", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "customer_base", "headquarters", "country" ] }, { "url": "https://www.piotech.cn/index.php/Pro/index?classid=3", "title": "Piotech ALD series (piotech.cn, Chinese)", "accessed": "2026-11-11", "fields": [ "tool_families" ] }, { "url": "https://www.piotech.cn/index.php/Pro/detail?id=637", "title": "Piotech Dione 300 hybrid bonder (piotech.cn, Chinese)", "accessed": "2026-11-11", "fields": [ "alignment_accuracy", "applications" ] } ], "verifiedAt": "2026-11-11" }, { "id": "psk", "name": "PSK", "url": "https://www.pskinc.com/", "summary": "Makes dry-strip and related wafer-processing equipment for semiconductor fabs. Its SUPRA systems remove photoresist and process residues while limiting plasma damage.", "hq": "KR", "tags": [ "Etch" ], "fields": { "process_steps": "Dry photoresist stripping", "step": "Etch and strip", "tool_families": "SUPRA Vplus, N, Nm and XP", "applications": "High-dose ion implant strip; metal/low-k underlayers; hard-mask strip; post-etch strip/clean", "technical_capabilities": "SUPRA lineup includes oxygen-free processing and microwave-source plasma-damage-free processing options", "market_share": "Claims largest global dry-strip share on product page; percentage and measurement year undisclosed", "headquarters": "South Korea", "country": "South Korea" }, "sources": [ { "url": "https://www.pskinc.com/producttech/dry_strip.php", "title": "pskinc.com / dry strip", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "technical_capabilities", "market_share" ] }, { "url": "https://www.pskinc.com/theme/bpsk/main_inc/pdf/ESG_%EC%A7%80%EC%86%8D%EA%B0%80%EB%8A%A5%EA%B2%BD%EC%98%81%EB%B3%B4%EA%B3%A0%EC%84%9C2023%28%EA%B5%AD%EB%AC%B8%29.pdf", "title": "pskinc.com / ESG 지속가능경영보고서2023(국문)", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "pva-tepla", "name": "PVA TePla", "url": "https://www.pvatepla.com/", "summary": "Makes crystal-growth and metrology equipment for semiconductor materials manufacturers. Its Czochralski systems produce high-purity silicon ingots used to make wafers.", "hq": "DE", "tags": [], "fields": { "process_steps": "Czochralski silicon crystal growth", "step": "Materials and handling", "tool_families": "SC-Line and CGS1218 crystal pullers", "applications": "Silicon substrates for logic, memory, analog/mixed-signal and power-management ICs", "wafer_sizes_mm": "SC-Line produces silicon ingots of 200–300 mm diameter", "technical_capabilities": "CGS1218 load capacity: up to 450 kg; ingot length: 2,800 mm", "headquarters": "Wettenberg, Germany", "country": "Germany" }, "sources": [ { "url": "https://www.pvatepla.com/products-technologies/crystal-growth/czochralski-process/", "title": "pvatepla.com / czochralski process", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "wafer_sizes_mm" ] }, { "url": "https://www.pvatepla.com/products-technologies/crystal-growth/czochralski-process/cgs1218/", "title": "pvatepla.com / cgs1218", "accessed": "2026-11-11", "fields": [ "technical_capabilities" ] }, { "url": "https://www.pvatepla.com/locations/", "title": "pvatepla.com / locations", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "screen", "name": "SCREEN Semiconductor Solutions", "url": "https://www.screen.co.jp/spe/en/", "summary": "Through SCREEN Semiconductor Solutions, makes wafer cleaning systems and other production equipment for chip manufacturers. Its SU-3400 is a high-throughput single-wafer cleaner.", "hq": "JP", "tags": [], "fields": { "process_steps": "Single-wafer cleaning", "step": "Cleaning and CMP", "tool_families": "SU-3400", "wafer_sizes_mm": "SU-3400: 300", "throughput": "SU-3400: up to 1,200 wafers/hour", "technical_capabilities": "SU-3400: 24-chamber configuration", "market_share": "Vendor claims top global share in single-wafer cleaning, batch cleaning and spin scrubbers; July 2025; no percentage disclosed", "installed_base": "More than 15,000 cumulative semiconductor cleaning equipment shipments as of 2025-07-01", "headquarters": "Kyoto, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.screen.co.jp/spe/en/products/su-3400", "title": "screen.co.jp / su 3400", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "throughput", "technical_capabilities" ] }, { "url": "https://www.screen.co.jp/spe/en/information/spe250701", "title": "screen.co.jp / spe250701", "accessed": "2026-11-11", "fields": [ "market_share", "installed_base" ] }, { "url": "https://www.screen.co.jp/en/about/outline", "title": "screen.co.jp / outline", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "semes", "name": "SEMES", "url": "https://www.semes.com/", "summary": "Makes semiconductor front-end, test, packaging, and factory automation equipment. Its front-end portfolio includes wafer cleaners, photo tracks, and plasma etchers.", "hq": "KR", "tags": [ "Lithography", "Etch", "Test" ], "fields": { "process_steps": "Cleaning; photo-track lithography; etch; probing; handling; factory logistics", "step": "Several steps", "tool_families": "LOTUS and BLUEICE PRIME cleaners; OMEGA-S/K tracks; Michelan O3/C4 etchers", "technical_capabilities": "Supercritical cleaning uses liquefied CO2 under high pressure and temperature", "customer_base": "Etch and overhead transport supplied to Samsung Electronics", "wafer_sizes_mm": "LOTUS: 300", "headquarters": "South Korea", "country": "South Korea" }, "sources": [ { "url": "https://www.semes.com/en/company/corporate-overview", "title": "semes.com / corporate overview", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "technical_capabilities", "customer_base" ] }, { "url": "https://semes.com/en/company/history/view", "title": "semes.com / view", "accessed": "2026-11-11", "fields": [ "wafer_sizes_mm" ] }, { "url": "https://semes.com/en/company/establishment-information", "title": "semes.com / establishment information", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "smee", "name": "SMEE (Shanghai Micro Electronics Equipment)", "url": "https://www.smee.com.cn/", "summary": "China's main lithography toolmaker. Its SSX600 step-and-scan scanners serve front-end IC layers at 90, 110 and 280 nm nodes; the SSB800 i-line scanner serves mature-node power, analog and MEMS lines.", "hq": "CN", "tags": [ "Lithography" ], "fields": { "process_steps": "Front-end and mature-node photolithography", "step": "Lithography", "tool_families": "SSX600 step-and-scan scanner; SSB800 i-line scanner; SSC800 series", "applications": "SSX600: critical and non-critical layers at 90, 110 and 280 nm nodes; SSB800: 280 nm and above for power, analog and MEMS", "wafer_sizes_mm": "SSX600: 200 or 300", "technical_capabilities": "SSX600: 4x reduction projection lens; six-degree-of-freedom self-damping wafer and mask stages", "headquarters": "Pudong New Area, Shanghai, China", "country": "China" }, "sources": [ { "url": "https://www.smee.com.cn/", "title": "SMEE home page (Chinese)", "accessed": "2026-11-11", "fields": [ "step", "tool_families", "headquarters", "country" ] }, { "url": "https://www.smee.com.cn/eis.pub?service=homepageService&method=indexinfo&onclicknodeno=1_4_1_1", "title": "SMEE SSX600 series (Chinese)", "accessed": "2026-11-11", "fields": [ "process_steps", "applications", "wafer_sizes_mm", "technical_capabilities" ] }, { "url": "https://www.smee.com.cn/eis.pub?service=homepageService&method=indexinfo&onclicknodeno=1_4_1_2", "title": "SMEE SSB800 series (Chinese)", "accessed": "2026-11-11", "fields": [ "applications" ] } ], "verifiedAt": "2026-11-11" }, { "id": "suss-microtec", "name": "SUSS MicroTec", "url": "https://www.suss.com/", "summary": "Makes semiconductor process equipment including wafer bonding platforms. Its XBS300 W2W integrates hybrid/fusion bonding, surface activation, cleaning, and metrology for 3D integration.", "hq": "DE", "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Hybrid and fusion wafer bonding", "step": "Packaging and assembly", "tool_families": "XBS300 W2W", "wafer_sizes_mm": "XBS300 W2W: 200 and 300", "alignment_accuracy": "XBA Inter Substrate Alignment: overlay below 100 nm", "applications": "Wafer-to-wafer and collective die-to-wafer bonding for 3D stacked memory and 3D SoCs", "commercial_status": "Supports R&D and high-volume production", "headquarters": "Garching, Germany", "country": "Germany" }, "sources": [ { "url": "https://www.suss.com/en/products-solutions/bonding-solutions/permanent-bonding/xbs300-w2w", "title": "suss.com / xbs300 w2w", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "alignment_accuracy", "applications", "commercial_status" ] }, { "url": "https://www.suss.com/cn/news/corporate-news/2026/suss-reports-first-nine-months-2026-results-record-order-book-of-601-million-provides-strong-visibility", "title": "suss.com / suss reports first nine months 2026 results record orde", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "teradyne", "name": "Teradyne", "url": "https://www.teradyne.com/", "summary": "Makes automated test equipment for semiconductor production. Its AI-oriented portfolio includes logic, high-bandwidth-memory, and power-device test platforms.", "hq": "US", "tags": [ "Test" ], "fields": { "process_steps": "Automated semiconductor production test", "step": "Test and probing", "tool_families": "UltraFLEXplus; Magnum 7H; ETS-800", "ai_relevant_tools": "UltraFLEXplus for AI accelerators, custom ASICs and mobile SoCs", "ai_link": true, "applications": "Magnum 7H: HBM, DDR5 and next-generation AI memory production test", "technical_capabilities": "Test insertions include wafer, die, substrate and package", "headquarters": "North Reading, Massachusetts, United States", "country": "United States", "revenue": "US$3.19 billion, 2025, company total incl. robotics" }, "sources": [ { "url": "https://www.teradyne.com/artificial-intelligence/", "title": "teradyne.com / artificial intelligence", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "ai_relevant_tools", "ai_link", "applications", "technical_capabilities" ] }, { "url": "https://www.teradyne.com/company/contact-teradyne/", "title": "teradyne.com / contact teradyne", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/97210/000119312526059002/0001193125-26-059002-index.htm", "title": "Teradyne Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "tokyo-electron", "name": "Tokyo Electron", "url": "https://www.tel.com/", "summary": "Makes deposition, lithography-track, etch, cleaning, probing, and bonding equipment for semiconductor fabs. Its portfolio supports both wafer fabrication and advanced packaging.", "hq": "JP", "tags": [ "Lithography", "Deposition", "Etch", "Test", "Advanced packaging and HBM" ], "fields": { "process_steps": "Deposition; lithography coating/development; etch; cleaning; testing; bonding/debonding", "step": "Several steps", "tool_families": "CLEAN TRACK LITHIUS Pro DICE coater/developer", "wafer_sizes_mm": "LITHIUS Pro DICE: 300", "applications": "LITHIUS Pro DICE supports EUV including High NA", "market_share": "CY2024 worldwide: coater/developer 92%; deposition 28% (ALD 16%, CVD 38%, oxidation/diffusion 37%); dry etch 27%; cleaning 21%; wafer bonder 32%; wafer prober 38%", "market_share_basis": "TEL chart (FY2025 Q4 deck, slide 27) based on Gartner 2024 WFE share, revenue-from-shipments basis, calculations by TEL; wafer prober from TechInsights auto-prober data (Apr 2025)", "ai_relevant_tools": "Etch for logic/HBM interconnects; temporary wafer bonders/debonders for HBM", "ai_link": true, "headquarters": "Tokyo, Japan", "country": "Japan", "revenue": "¥2,431.5 billion net sales, fiscal 2025 (year to 31 Mar 2025)" }, "sources": [ { "url": "https://www.tel.com/product/", "title": "tel.com / product", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "wafer_sizes_mm", "applications" ] }, { "url": "https://www.tel.com/ir/library/report/l8gqgo00000000gl-att/fy25q4presentations-e.pdf", "title": "tel.com / fy25q4presentations e", "accessed": "2026-11-11", "fields": [ "market_share", "market_share_basis", "ai_relevant_tools", "ai_link", "revenue" ] }, { "url": "https://www.tel.com/ir/stocks/asm/p9b06p00000001dz-att/62_01e.pdf", "title": "tel.com / 62 01e", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "towa", "name": "TOWA", "url": "https://www.towajapan.co.jp/", "summary": "Makes molding equipment that encapsulates semiconductors in resin. Its CPM systems support wafer-level and panel-level packaging with granular or liquid resin.", "hq": "JP", "founded": 1979, "tags": [ "Advanced packaging and HBM" ], "fields": { "process_steps": "Compression molding and semiconductor encapsulation", "step": "Packaging and assembly", "tool_families": "CPM1080 Full Auto and Semi Auto systems", "applications": "Fan-out/fan-in wafer-level and panel-level package molding", "substrate_dimensions": "CPM1080 Semi Auto: 300 mm wafers and 320 × 320 mm panels", "technical_capabilities": "Compatible with granular and liquid resins", "automation": "CPM1080 Semi Auto uses operator substrate loading and automatic resin supply", "headquarters": "Kyoto, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.towajapan.co.jp/en/products/molding/cpm/", "title": "towajapan.co.jp / cpm", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "substrate_dimensions", "technical_capabilities", "automation" ] }, { "url": "https://www.towajapan.co.jp/en/company/about/", "title": "towajapan.co.jp / about", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "ulvac", "name": "ULVAC", "url": "https://www.ulvac.co.jp/", "summary": "Makes vacuum-based semiconductor process equipment. Its ENTRON-EXX sputtering platform integrates deposition, preclean, heating, and cooling for logic, memory, and packaging production.", "hq": "JP", "founded": 1952, "tags": [ "Deposition" ], "fields": { "process_steps": "PVD sputter deposition and integrated preclean", "step": "Deposition and thermal", "tool_families": "ENTRON-EXX", "applications": "Logic, DRAM, NAND, nonvolatile memory and packaging", "batch_capacity": "ENTRON-EXX accommodates up to 12 process modules", "technical_capabilities": "Single- or tandem-transfer-chamber platform options", "headquarters": "Chigasaki, Japan", "country": "Japan" }, "sources": [ { "url": "https://www.ulvac.co.jp/en/products/sputtering_system/entron-exx/index.html", "title": "ulvac.co.jp / entron exx", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "batch_capacity", "technical_capabilities" ] }, { "url": "https://www.ulvac.co.jp/en/company/outline/", "title": "ulvac.co.jp / outline", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" }, { "id": "veeco", "name": "Veeco", "url": "https://www.veeco.com/", "summary": "Makes semiconductor process equipment for wafer fabrication and photonics manufacturing. Its ion-beam deposition, MOCVD, and wet-processing systems support indium-phosphide lasers used in optical interconnects.", "hq": "US", "tags": [ "Deposition" ], "fields": { "process_steps": "Ion-beam deposition; MOCVD epitaxy; wet processing", "step": "Deposition and thermal", "tool_families": "Spector IBD; Lumina MOCVD; WaferEtch wet processing", "applications": "InP lasers and 800G/1.6T optical transceivers for hyperscale data centers", "technical_capabilities": "Lumina uses TurboDisc reactor technology for high-volume InP epitaxy", "commercial_status": "Merger with Axcelis pending; China SAMR clearance is the only regulatory approval outstanding; close expected by end of Q1 2027 (10-Q filed 2026-11-05)", "headquarters": "Plainview, New York, United States", "country": "United States", "revenue": "US$664.3 million, 2025" }, "sources": [ { "url": "https://ir.veeco.com/news-and-events/news-details/2026/Veeco-Announces-250-Million-in-Equipment-Orders-for-Manufacturing-Indium-Phosphide-Lasers/default.aspx", "title": "ir.veeco.com / Veeco Announces 250 Million in Equipment Orders for Man", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "technical_capabilities" ] }, { "url": "https://ir.veeco.com/financial-information/proxy-materials/default.aspx", "title": "ir.veeco.com / proxy materials", "accessed": "2026-11-11", "fields": [ "headquarters", "country" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/1113232/000110465926123333/acls-20260930x10q.htm", "title": "Axcelis Form 10-Q, quarter to 30 Sep 2026 (SEC)", "accessed": "2026-11-11", "fields": [ "commercial_status" ] }, { "url": "https://www.sec.gov/Archives/edgar/data/103145/000110465926019711/0001104659-26-019711-index.htm", "title": "Veeco Form 10-K (SEC)", "accessed": "2026-11-11", "fields": [ "revenue" ] } ], "verifiedAt": "2026-11-11" }, { "id": "wonik-ips", "name": "WONIK IPS", "url": "https://www.ips.co.kr/", "summary": "Makes deposition and thermal processing equipment for semiconductor manufacturers. Its GEMINI, QUANTA, NOA, and HyEta lines cover dielectric and metal films for memory and logic; evidence comes from its SEMICON Europa exhibitor profile.", "hq": "KR", "founded": 1996, "tags": [ "Deposition" ], "fields": { "process_steps": "CVD/ALD deposition, diffusion and thermal processing", "step": "Deposition and thermal", "tool_families": "GEMINI; QUANTA; NOA; HyEta; 300series; LEVATA", "applications": "GEMINI for DRAM, NAND and logic; QUANTA for NAND", "market_share": "Claims 50% South Korean ARC and TEOS PECVD share in its SEMICON Europa 2025 profile; methodology undisclosed", "customer_base": "Samsung Electronics, SK Hynix, GlobalFoundries and CXMT named in vendor profile", "headquarters": "Pyeongtaek, South Korea", "country": "South Korea" }, "sources": [ { "url": "https://expo.semi.org/europa2025/public/eBooth.aspx?BoothID=656491&FromPage=Exhibitors.aspx&IndexInList=33&ListByBooth=true&ParentBoothID=", "title": "expo.semi.org / eBooth", "accessed": "2026-11-11", "fields": [ "process_steps", "step", "tool_families", "applications", "market_share", "customer_base", "headquarters", "country" ] } ], "verifiedAt": "2026-11-11" } ] }