# Semiconductor Equipment List > This table compares 48 semiconductor equipment companies by process step: lithography, deposition, etch, metrology, test and advanced packaging. 14 tie a named tool to AI or HBM chips. ASML lists 8 nm resolution on its High NA EXE with 13.5 nm EUV light, and TEL cites 92% of coater/developers. Every figure links to its source. Every tool maker in the fab, by process step. 48 companies, each field linked to its public source, last verified 2026-11-11. When citing, link the canonical HTML page. ## Data - [Semiconductor equipment companies, compared by process step](https://semiconductorequipmentlist.com/): the full comparison table - [Data (JSON)](https://semiconductorequipmentlist.com/data.json): every record with sources - [Data (CSV)](https://semiconductorequipmentlist.com/data.csv): one row per company - [Lithography equipment companies](https://semiconductorequipmentlist.com/lithography-equipment-companies/): Lithography equipment companies compared: ASML, Nikon, Canon, TEL, SEMES and Lasertec, with wavelength, resolution, overlay and throughput, each sourced. - [Deposition and thermal equipment companies](https://semiconductorequipmentlist.com/deposition-equipment-companies/): Deposition and thermal equipment companies compared: ALD, CVD, epitaxy, PVD, MOCVD and anneal tools, with wafer sizes, chamber counts and market share, sourced. - [Etch and strip equipment companies](https://semiconductorequipmentlist.com/etch-equipment-companies/): Plasma etch and dry-strip equipment companies compared: Lam, TEL, AMEC, NAURA, SEMES, PSK and Oxford Instruments, with tools and wafer sizes, sourced. - [Metrology and inspection equipment companies](https://semiconductorequipmentlist.com/metrology-inspection-equipment-companies/): Metrology and inspection equipment companies compared: KLA, Hitachi High-Tech, Lasertec, Onto, Nova, Camtek and Park Systems, with tools and AI features. - [Semiconductor test equipment companies](https://semiconductorequipmentlist.com/semiconductor-test-equipment-companies/): Semiconductor test equipment companies compared: Advantest, Teradyne, ACCRETECH, FormFactor, Cohu, TEL and SEMES, with probing accuracy and AI-chip test. - [Advanced packaging and HBM equipment companies](https://semiconductorequipmentlist.com/advanced-packaging-hbm-equipment-companies/): Advanced packaging and HBM equipment makers compared: hybrid and thermocompression bonders, molding, dicing and inspection, with accuracy and throughput. - [Methodology](https://semiconductorequipmentlist.com/methodology/): what each field means and how it is verified ## Companies - [ACCRETECH (Tokyo Seimitsu)](https://semiconductorequipmentlist.com/accretech/): Makes wafer probing and dicing equipment for semiconductor manufacturers. Its probing portfolio spans high-performance production probers and specialized systems for memory and smaller wafers. - [ACM Research](https://semiconductorequipmentlist.com/acm-research/): Makes wet-processing and cleaning equipment for semiconductor fabs. Its Ultra C SAPS systems use megasonic cleaning on flat and patterned wafers. - [Advantest](https://semiconductorequipmentlist.com/advantest/): Makes automated semiconductor test systems for chip designers, fabs and test providers. Its scalable V93000 platform tests complex systems on chip, including AI and high-performance computing devices. - [AIXTRON](https://semiconductorequipmentlist.com/aixtron/): Makes deposition systems for compound semiconductor manufacturers. Its G10-SiC batch epitaxy reactor targets silicon-carbide power electronics. - [AMEC (Advanced Micro-Fabrication Equipment)](https://semiconductorequipmentlist.com/amec/): Makes semiconductor etch equipment for chip manufacturers. Its Primo Twin-Star ICP etcher processes conductive and dielectric films for logic, memory, and power devices. - [Applied Materials](https://semiconductorequipmentlist.com/applied-materials/): Supplies chip fabrication and advanced packaging equipment to logic, memory, and outsourced assembly manufacturers. Its AI-focused products include hybrid bonding, epitaxy, and electron-beam metrology systems. - [ASM International](https://semiconductorequipmentlist.com/asm-international/): Makes deposition equipment for semiconductor fabs, including atomic layer deposition and epitaxy. Its epitaxy portfolio covers advanced logic and memory devices as well as silicon-carbide processes. - [ASML](https://semiconductorequipmentlist.com/asml/): Makes lithography systems that pattern wafers for logic and memory chip manufacturers. Its EUV range includes NXE and High NA EXE systems. - [ASMPT](https://semiconductorequipmentlist.com/asmpt/): Makes semiconductor assembly equipment including precision die bonders and thermocompression systems. Its AMICRA NANO supports photonic assembly, while its broader packaging portfolio serves AI computing and HBM. - [Axcelis Technologies](https://semiconductorequipmentlist.com/axcelis-technologies/): Makes ion implantation systems for semiconductor manufacturers. Its Purion H200 combines high-current implantation with medium-energy processing for silicon and silicon-carbide applications. - [Besi (BE Semiconductor Industries)](https://semiconductorequipmentlist.com/besi/): Makes semiconductor assembly equipment for chip manufacturers and assembly subcontractors. Its Datacon hybrid bonding platform places thin dies for high-density interconnects and 3D integration. - [Camtek](https://semiconductorequipmentlist.com/camtek/): Makes wafer inspection and metrology equipment for advanced packaging and specialty semiconductors. Its Eagle G5 addresses fine-pitch bumps and hybrid-bonding interconnects. - [Canon](https://semiconductorequipmentlist.com/canon/): Makes semiconductor lithography equipment, including nanoimprint systems. The FPA-1200NZ2C transfers circuit patterns by pressing a patterned mask into resist on a wafer. - [Cohu](https://semiconductorequipmentlist.com/cohu/): Makes semiconductor test, handling, inspection, and automation equipment. Its Eclipse handler supports production testing of high-power computing devices with dynamic thermal control. - [Daifuku](https://semiconductorequipmentlist.com/daifuku/): Makes automated material-handling and storage systems for semiconductor factories. Its Cleanway transports wafer carriers, and its CLW-A7 handles heavy substrates in back-end packaging. - [DISCO](https://semiconductorequipmentlist.com/disco/): Makes precision wafer dicing equipment for semiconductor production. Its DFD6363 fully automatic dicing saw supports 300 mm wafers and multiple cutting processes. - [Ebara](https://semiconductorequipmentlist.com/ebara/): Makes chemical mechanical polishing and electroplating systems for semiconductor and packaging manufacturers. Its F-REX CMP systems serve R&D and mass production, while UFP supports panel plating. - [EV Group](https://semiconductorequipmentlist.com/ev-group/): Makes wafer bonding equipment for semiconductor manufacturers and research users. Its GEMINI FB platform integrates alignment and fusion bonding for stacked memory, 3D systems on chip, and image sensors. - [FormFactor](https://semiconductorequipmentlist.com/formfactor/): Makes probe systems and test interfaces for semiconductor characterization and production. Its CM300xi supports automated on-wafer measurements across a wide temperature range. - [Hanmi Semiconductor](https://semiconductorequipmentlist.com/hanmi-semiconductor/): Makes back-end semiconductor equipment including thermocompression bonders, saws, and placement systems. Its HBM TC BONDER line targets stacked memory used in AI semiconductors; product evidence comes from its SEMICON Korea exhibitor profile. - [Hanwha Semitech](https://semiconductorequipmentlist.com/hanwha-semitech/): Makes semiconductor back-end bonders, including flip-chip bonders and the SFM5-Expert thermocompression bonder, for IDM and OSAT customers. It added PE-CVD and ALD front-end tools in 2024. - [Hitachi High-Tech](https://semiconductorequipmentlist.com/hitachi-high-tech/): Makes semiconductor metrology equipment for process control in wafer fabs. Its CG7300 critical-dimension SEM measures patterns in EUV-era device production. - [Jusung Engineering](https://semiconductorequipmentlist.com/jusung-engineering/): Makes semiconductor thin-film deposition equipment. Its ALD/CVD systems target advanced DRAM, 3D NAND, and logic devices, and its Eureka line provides epitaxy. - [KLA](https://semiconductorequipmentlist.com/kla/): Makes semiconductor process-control equipment for detecting defects and improving manufacturing yield. Its systems inspect patterned and unpatterned wafers, and its packaging products inspect and sort assembled devices. - [Kokusai Electric](https://semiconductorequipmentlist.com/kokusai-electric/): Makes batch deposition and thermal treatment equipment for semiconductor fabs. Its mini-batch and large-batch platforms form thin films on increasingly complex 3D devices. - [Kulicke & Soffa](https://semiconductorequipmentlist.com/kulicke-and-soffa/): Makes semiconductor assembly equipment for chiplet and stacked-die packaging. Its APTURA thermocompression platform supports direct copper-to-copper bonding and development of bumpless chip-to-wafer interconnects. - [Lam Research](https://semiconductorequipmentlist.com/lam-research/): Supplies wafer fabrication equipment to semiconductor manufacturers. Its Akara conductor etcher targets advanced transistor and memory structures, and ALTUS Halo deposits molybdenum. - [Lasertec](https://semiconductorequipmentlist.com/lasertec/): Makes inspection systems for semiconductor masks and wafers. Its ACTIS systems inspect EUV masks using the same wavelength as EUV lithography. - [Mattson Technology](https://semiconductorequipmentlist.com/mattson-technology/): Makes semiconductor wafer-processing equipment including rapid thermal processing and plasma etch systems. Its Helios RTP systems use double-sided heating for logic, memory, sensor, and other device processes. - [NAURA Technology Group](https://semiconductorequipmentlist.com/naura-technology-group/): Makes semiconductor process equipment covering etch, deposition, cleaning, furnaces, implantation, and bonding. Its plasma etch portfolio serves integrated circuits, advanced packaging, and compound semiconductors. - [Nikon](https://semiconductorequipmentlist.com/nikon/): Makes optical lithography systems for semiconductor manufacturers. Its NSR-S636E ArF immersion scanner patterns critical layers and supports 3D device production. - [Nova](https://semiconductorequipmentlist.com/nova/): Makes semiconductor metrology equipment for process control. Its Prism 2 optical critical-dimension platform addresses advanced logic, memory, and packaging measurements. - [Onto Innovation](https://semiconductorequipmentlist.com/onto-innovation/): Makes inspection and metrology systems for semiconductor fabs and advanced packaging manufacturers. Its Dragonfly G3 uses infrared inspection to find hidden defects in bonded and thinned wafers. - [Oxford Instruments Plasma Technology](https://semiconductorequipmentlist.com/oxford-instruments-plasma/): Makes plasma process equipment for semiconductor manufacturing. Its PlasmaPro 100 Cobra ICP etcher serves compound-semiconductor, power-device, optoelectronic, MEMS, and sensor applications. - [Park Systems](https://semiconductorequipmentlist.com/park-systems/): Korean maker of atomic force microscopes. Its NX-Wafer is an automated in-line AFM for 300 mm fabs that runs defect review, CMP profiling and sub-angstrom roughness measurement. - [Piotech](https://semiconductorequipmentlist.com/piotech/): Shenyang-based maker of thin-film deposition tools (PECVD, ALD, SACVD, HDPCVD and flowable CVD) and 3D-integration equipment for wafer-to-wafer and die-to-wafer hybrid bonding. - [PSK](https://semiconductorequipmentlist.com/psk/): Makes dry-strip and related wafer-processing equipment for semiconductor fabs. Its SUPRA systems remove photoresist and process residues while limiting plasma damage. - [PVA TePla](https://semiconductorequipmentlist.com/pva-tepla/): Makes crystal-growth and metrology equipment for semiconductor materials manufacturers. Its Czochralski systems produce high-purity silicon ingots used to make wafers. - [SCREEN Semiconductor Solutions](https://semiconductorequipmentlist.com/screen/): Through SCREEN Semiconductor Solutions, makes wafer cleaning systems and other production equipment for chip manufacturers. Its SU-3400 is a high-throughput single-wafer cleaner. - [SEMES](https://semiconductorequipmentlist.com/semes/): Makes semiconductor front-end, test, packaging, and factory automation equipment. Its front-end portfolio includes wafer cleaners, photo tracks, and plasma etchers. - [SMEE (Shanghai Micro Electronics Equipment)](https://semiconductorequipmentlist.com/smee/): China's main lithography toolmaker. Its SSX600 step-and-scan scanners serve front-end IC layers at 90, 110 and 280 nm nodes; the SSB800 i-line scanner serves mature-node power, analog and MEMS lines. - [SUSS MicroTec](https://semiconductorequipmentlist.com/suss-microtec/): Makes semiconductor process equipment including wafer bonding platforms. Its XBS300 W2W integrates hybrid/fusion bonding, surface activation, cleaning, and metrology for 3D integration. - [Teradyne](https://semiconductorequipmentlist.com/teradyne/): Makes automated test equipment for semiconductor production. Its AI-oriented portfolio includes logic, high-bandwidth-memory, and power-device test platforms. - [Tokyo Electron](https://semiconductorequipmentlist.com/tokyo-electron/): Makes deposition, lithography-track, etch, cleaning, probing, and bonding equipment for semiconductor fabs. Its portfolio supports both wafer fabrication and advanced packaging. - [TOWA](https://semiconductorequipmentlist.com/towa/): Makes molding equipment that encapsulates semiconductors in resin. Its CPM systems support wafer-level and panel-level packaging with granular or liquid resin. - [ULVAC](https://semiconductorequipmentlist.com/ulvac/): Makes vacuum-based semiconductor process equipment. Its ENTRON-EXX sputtering platform integrates deposition, preclean, heating, and cooling for logic, memory, and packaging production. - [Veeco](https://semiconductorequipmentlist.com/veeco/): Makes semiconductor process equipment for wafer fabrication and photonics manufacturing. Its ion-beam deposition, MOCVD, and wet-processing systems support indium-phosphide lasers used in optical interconnects. - [WONIK IPS](https://semiconductorequipmentlist.com/wonik-ips/): Makes deposition and thermal processing equipment for semiconductor manufacturers. Its GEMINI, QUANTA, NOA, and HyEta lines cover dielectric and metal films for memory and logic; evidence comes from its SEMICON Europa exhibitor profile. ## Optional - [All records in one file](https://semiconductorequipmentlist.com/llms-full.txt) - [Sitemap](https://semiconductorequipmentlist.com/sitemap.xml)