ACCRETECH (Tokyo Seimitsu)

Makes wafer probing and dicing equipment for semiconductor manufacturers. Its probing portfolio spans high-performance production probers and specialized systems for memory and smaller wafers.

HQ JP Founded 1949 Test

Verified 11 Nov 2026

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Facts

Source per value

Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.: Test and probing 1
HQ country Country of the corporate headquarters or principal corporate address stated by the company.: Japan 1
Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.: Wafer probing and dicing 1
Tools and product families Named equipment models or product families supported by the cited vendor material.: AP3000/AP3000e production probers; UF2000 200 mm prober 1
Target devices and applications Device types, materials or production uses the source states for the tool.: Not published
AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.: Not published
AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.: Not published
AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.: Not published
Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.: UF2000: 200 1
Operating wavelength nm Light wavelength of the named lithography or inspection tool.: Not published
Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.: Not published
Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.: UF2000 probing precision: ±1.5 µm 1
Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.: Not published
Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.: Not published
Batch or chamber capacity Wafers per batch or process chambers, for the cited model.: Not published
Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.: Not published
Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.: Not published
Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.: Not published
Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.: Prober factory integration supports SEMI GEM E30, CMS E87, PJ E40 and CJ E94 1
Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.: Not published
Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.: Not published
Market-share basis Research provider, measurement basis and period behind the paired market-share figure.: Not published
Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.: Not published
Customers Customer types or named customers in the source.: Not published
Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.: Not published
Product launch Dated product announcement or sales launch, with context.: Not published
Headquarters Corporate headquarters or principal corporate address as the company states it.: Japan 1

Sources

accretech.com / companyprofile E accessed 2026-11-11

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