Methodology
Primary sources, one link per number, a date on every row.
Where the data comes from
We read each company’s own product pages, datasheets, filings, investor presentations, press releases and trade-show exhibitor profiles, plus named industry reports. Every record lists its sources with the date we accessed them, and every number in the table links to the source it came from.
Who is in scope
A company is listed when it sells complete process, metrology, test, packaging or fab-automation tools to chipmakers and OSATs. Suppliers of subsystems, components and materials to those toolmakers (Ultra Clean, Ichor, MKS, Entegris and similar) sit one tier up the chain and stay out, as do divisions and acquired brands, which appear under their parent.
Revenue
Annual revenue is the company total for the fiscal year named, taken from its 10-K, 20-F or annual report in the reporting currency. It includes any non-equipment business the company runs, so it sizes the company, not its share of one process step.
Process steps and pages
Each company gets one main Process step and appears on every step page its cited tools belong to. A company that sells tools in three or more steps is grouped as Several steps. We assign steps from the process the cited product material names, not from company size or revenue. The six step pages are lithography, deposition and thermal, etch and strip, metrology and inspection, test, and advanced packaging with HBM.
Specs and market share
Specs are per named model, in the vendor’s own metric, so resolution, overlay and throughput are comparable only when the units and conditions match. Market-share figures come with their segment, year and basis. A figure from a research provider is shown as such, and a company’s own claim is labelled a claim.
How we verify
Each row shows the date we last checked it. A field is filled only when a source states it; when a company does not publish a figure, the cell stays empty.
Corrections
Vendors and readers can send corrections to hello@semiconductorequipmentlist.com with a public source. We update the row and its verified date. Featured placement is paid and labelled; it never changes a row’s data or its position in the sorted table.
Reuse
The dataset is free to reuse under CC BY 4.0 with a link to semiconductorequipmentlist.com. Download it as CSV or JSON.
Field definitions
27 fields- Process step
- The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.
- HQ country
- Country of the corporate headquarters or principal corporate address stated by the company.
- Process steps covered
- Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.
- Tools and product families
- Named equipment models or product families supported by the cited vendor material.
- Target devices and applications
- Device types, materials or production uses the source states for the tool.
- AI-relevant tools
- True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.
- AI-relevant tools (detail)
- The tool and the AI, HBM or data-center link, as the source states it.
- AI inside the equipment
- AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.
- Wafer or ingot diameters mm
- Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.
- Operating wavelength nm
- Light wavelength of the named lithography or inspection tool.
- Patterning resolution
- Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.
- Alignment, overlay or probing accuracy
- The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- Rated throughput
- Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.
- Technical capabilities
- Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- Batch or chamber capacity
- Wafers per batch or process chambers, for the cited model.
- Process or test temperature °C
- Temperature range or limit for the named equipment, with configuration qualifiers.
- Substrate or die dimensions
- Model-specific substrate, panel or die dimensions and units.
- Wafer inspection coverage %
- Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.
- Automation and integration
- Material handling, maintenance or factory interfaces supported by the cited model.
- Annual revenue
- Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.
- Market share or position
- Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.
- Market-share basis
- Research provider, measurement basis and period behind the paired market-share figure.
- Installed base or shipments
- Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.
- Customers
- Customer types or named customers in the source.
- Commercial or corporate status
- Dated product adoption, qualification or pending corporate transaction.
- Product launch
- Dated product announcement or sales launch, with context.
- Headquarters
- Corporate headquarters or principal corporate address as the company states it.