Etch and strip equipment companies
7 of 48 companies sell plasma etch or dry-strip tools. Lam Research rates its Akara DirectDrive source 100 times faster in responsiveness than earlier sources (vendor comparison). AMEC fits up to three dual-station chambers on the Primo Twin-Star, Oxford Instruments lists an electrode range of -150 °C to +400 °C on the PlasmaPro 100 Cobra, and PSK claims the largest global dry-strip share without publishing a figure.
| Tools and product families | Target devices and applications | Wafer or ingot diametersmm | Technical capabilities | Process or test temperature°C | Market share or position | |||
|---|---|---|---|---|---|---|---|---|
| AMEC (Advanced Micro-Fabrication Equipment) | Primo Twin-Star | Silicon structures in CIS/power devices and conductive/dielectric films in logic/DRAM | Primo Twin-Star: 300 | Up to three dual-station etch chambers plus two optional integrated strip chambers | — | — | China | 2026-11-11 |
| Lam Research | Akara conductor etch | Advanced planar DRAM and foundry gate-all-around production | — | DirectDrive plasma source: 100 times faster responsiveness than previous sources, vendor comparison | — | — | United States | 2026-11-11 |
| NAURA Technology Group | NMC 612E ICP etcher; Accura LX dielectric etcher; HSE P300 deep-silicon etcher | Integrated circuits, advanced packaging and compound semiconductors | NMC 612E: 12-inch wafers (nominal 300 mm) | Etches silicon, deep silicon, metals, dielectrics and compounds including SiC, GaN, GaAs and InP | — | — | China | 2026-11-11 |
| Oxford Instruments Plasma Technology | PlasmaPro 100 Cobra | GaAs/InP optoelectronics; SiC/GaN power and RF; MEMS and sensors | PlasmaPro 100 Cobra: up to 200 | — | Electrode range: -150°C to +400°C; cooling/heating configuration dependent | — | United Kingdom | 2026-11-11 |
| PSK | SUPRA Vplus, N, Nm and XP | High-dose ion implant strip; metal/low-k underlayers; hard-mask strip; post-etch strip/clean | — | SUPRA lineup includes oxygen-free processing and microwave-source plasma-damage-free processing options | — | Claims largest global dry-strip share on product page; percentage and measurement year undisclosed | South Korea | 2026-11-11 |
| SEMES | LOTUS and BLUEICE PRIME cleaners; OMEGA-S/K tracks; Michelan O3/C4 etchers | — | LOTUS: 300 | Supercritical cleaning uses liquefied CO2 under high pressure and temperature | — | — | South Korea | 2026-11-11 |
| Tokyo Electron | CLEAN TRACK LITHIUS Pro DICE coater/developer | LITHIUS Pro DICE supports EUV including High NA | LITHIUS Pro DICE: 300 | — | — | CY2024 worldwide: coater/developer 92%; deposition 28% (ALD 16%, CVD 38%, oxidation/diffusion 37%); dry etch 27%; cleaning 21%; wafer bonder 32%; wafer prober 38% | Japan | 2026-11-11 |
The tools behind each row
All 48 companiesHow to read the columns
Methodology- Tools and product families
- Named equipment models or product families supported by the cited vendor material.
- Target devices and applications
- Device types, materials or production uses the source states for the tool.
- Wafer or ingot diameters mm
- Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.
- Technical capabilities
- Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- Process or test temperature °C
- Temperature range or limit for the named equipment, with configuration qualifiers.
- Market share or position
- Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.
- HQ country
- Country of the corporate headquarters or principal corporate address stated by the company.