Advanced packaging and HBM equipment companies
17 of 48 companies sell advanced packaging and HBM-stacking tools, and 8 tie a named tool to AI or HBM chips. Hybrid-bonding alignment runs from below 50 nm (EV Group) to below 100 nm (SUSS MicroTec) and 100 nm at 3 sigma (Besi). For thermocompression, Hanmi Semiconductor claims the No.1 global HBM TC bonder position without a percentage, Hanwha Semitech sells the SFM5-Expert TC bonder, and Kulicke & Soffa and ASMPT sell thermocompression systems for AI chiplets and HBM. Besi lists up to 2,000 components per hour in dry cycle.
| Tools and product families | Alignment, overlay or probing accuracy | Rated throughput | Substrate or die dimensions | AI-relevant tools (detail) | Commercial or corporate status | Market share or position | ||
|---|---|---|---|---|---|---|---|---|
| Applied Materials | Kinex hybrid bonder | — | — | — | Kinex, Xtera and PROVision 10 target GAA logic, HBM and advanced packaging for AI | Kinex used by leading-edge logic, memory and OSAT customers, announced 2025-10-07 | — | 2026-11-11 |
| ASMPT | AMICRA NANO | AMICRA NANO placement: ±0.2 µm at 3 sigma; performance depends on package and material | — | — | TCB systems serve AI data-center packaging; memory-tool decisions linked to HBM4 rollouts (Q3 2026 disclosure) | — | — | 2026-11-11 |
| Besi (BE Semiconductor Industries) | Datacon 8800 CHAMEO ultra plus AC | 100 nm at 3 sigma, worst-corner glass-on-glass alignment | Up to 2,000 components/hour in dry cycle | Die thickness: 25–800 µm | — | — | — | 2026-11-11 |
| Camtek | Eagle Generation-5 (Eagle G5) | — | — | — | — | Orders received for 2025 deliveries; launch announced 2024-09-24 | — | 2026-11-11 |
| Daifuku | Cleanway overhead transport | — | — | — | CLW-A7 developed for larger panels and heavy loads as AI chiplet packaging advances | — | — | 2026-11-11 |
| DISCO | DFD6363 | — | — | — | — | — | — | 2026-11-11 |
| Ebara | F-REX200M2 and F-REX300X CMP; UFP-AS plating | — | — | — | — | — | — | 2026-11-11 |
| EV Group | GEMINI FB XT | SmartView NT3: wafer-to-wafer alignment below 50 nm | — | — | IR LayerRelease transfers ultra-thin silicon layers for 3D integration and AI/HPC chips | — | — | 2026-11-11 |
| Hanmi Semiconductor | TC BONDER 4.5 GRIFFIN; TC BONDER 4.0 TIGER | — | — | — | HBM thermocompression bonders for AI semiconductors | — | Claims No.1 global HBM TC bonder position in its SEMICON Korea 2026 profile; percentage/methodology undisclosed | 2026-11-11 |
| Hanwha Semitech | SFM5-Expert thermocompression bonder; flip-chip bonders | — | — | — | — | — | — | 2026-11-11 |
| Kulicke & Soffa | APTURA | — | — | — | Thermocompression chip-to-substrate equipment for AI and HPC chiplets and stacked dies | Bumpless chip-to-wafer hybrid bonding demonstrated with collaborators; announced 2024-08-07 | — | 2026-11-11 |
| NAURA Technology Group | NMC 612E ICP etcher; Accura LX dielectric etcher; HSE P300 deep-silicon etcher | — | — | — | — | — | — | 2026-11-11 |
| Onto Innovation | Dragonfly G3 | — | — | — | Dragonfly G3 supports HBM and advanced logic packaging relevant to AI GPUs | Multiple orders for the new subsurface capability announced 2024-04-23 | — | 2026-11-11 |
| Piotech | PF-300T and VS-300T Astra PEALD; TS-300 Altair thermal ALD; Dione 300 hybrid bonder; Pleione 300 die-to-wafer fusion bonder | Dione 300: post-bond overlay at the hundred-nanometre level | — | — | — | — | — | 2026-11-11 |
| SUSS MicroTec | XBS300 W2W | XBA Inter Substrate Alignment: overlay below 100 nm | — | — | — | Supports R&D and high-volume production | — | 2026-11-11 |
| Tokyo Electron | CLEAN TRACK LITHIUS Pro DICE coater/developer | — | — | — | Etch for logic/HBM interconnects; temporary wafer bonders/debonders for HBM | — | CY2024 worldwide: coater/developer 92%; deposition 28% (ALD 16%, CVD 38%, oxidation/diffusion 37%); dry etch 27%; cleaning 21%; wafer bonder 32%; wafer prober 38% | 2026-11-11 |
| TOWA | CPM1080 Full Auto and Semi Auto systems | — | — | CPM1080 Semi Auto: 300 mm wafers and 320 × 320 mm panels | — | — | — | 2026-11-11 |
The tools behind each row
All 48 companiesHow to read the columns
Methodology- Tools and product families
- Named equipment models or product families supported by the cited vendor material.
- Alignment, overlay or probing accuracy
- The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- Rated throughput
- Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.
- Substrate or die dimensions
- Model-specific substrate, panel or die dimensions and units.
- AI-relevant tools (detail)
- The tool and the AI, HBM or data-center link, as the source states it.
- Commercial or corporate status
- Dated product adoption, qualification or pending corporate transaction.
- Market share or position
- Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.