Metrology and inspection equipment companies
8 of 48 companies sell metrology or inspection tools, and 2 describe AI or machine learning inside them. KLA runs DefectWise AI on patterned-wafer inspection, Nova applies machine-learning algorithms to optical critical-dimension metrology, Onto Innovation states 100% wafer inspection for sub-surface defects with infrared, and Lasertec inspects EUV masks at the 13.5 nm wavelength used to print them.
| Tools and product families | Technical capabilities | AI inside the equipment | Target devices and applications | Commercial or corporate status | ||||
|---|---|---|---|---|---|---|---|---|
| Applied Materials | Kinex hybrid bonder | Centura Xtera: 50% lower gas usage than conventional epitaxy, vendor comparison | — | — | — | — | Kinex used by leading-edge logic, memory and OSAT customers, announced 2025-10-07 | 2026-11-11 |
| Camtek | Eagle Generation-5 (Eagle G5) | Advanced packaging inspection for fine-pitch microbumps and hybrid-bonding interconnects | — | — | — | High-performance computing, CMOS image sensors and silicon carbide | Orders received for 2025 deliveries; launch announced 2024-09-24 | 2026-11-11 |
| Hitachi High-Tech | CG7300 advanced CD measurement SEM | CG7300 improves tool-to-tool matching performance by around 10% versus the previous model | — | — | — | Semiconductor mass production using EUV lithography | — | 2026-11-11 |
| KLA | 8935 patterned-wafer inspector | I-PAT applies machine learning to identify outlier defect populations | DefectWise AI identifies critical defects during high-volume manufacturing | — | — | Automotive chip manufacturing | — | 2026-11-11 |
| Lasertec | ACTIS A150 | ACTIS A150 supports through-pellicle inspection | — | — | 13.51 | EUV mask manufacturing quality assurance and incoming/periodic fab mask inspection | — | 2026-11-11 |
| Nova | Nova Prism 2 | Spectral interferometry information channel | Machine-learning metrology algorithms | — | — | Advanced memory and logic nodes, plus packaging metrology | — | 2026-11-11 |
| Onto Innovation | Dragonfly G3 | Infrared subsurface inspection across the entire wafer | — | 1001 | — | — | Multiple orders for the new subsurface capability announced 2024-04-23 | 2026-11-11 |
| Park Systems | Park NX-Wafer automated AFM | Noise floor below 0.5 Å; XY scan 100 × 100 µm; Z scan 15 µm, 30 µm optional | — | — | — | Automatic defect review and classification; CMP profiling of dishing, erosion and edge-over-erosion; sub-angstrom roughness | — | 2026-11-11 |
The tools behind each row
All 48 companiesHow to read the columns
Methodology- Tools and product families
- Named equipment models or product families supported by the cited vendor material.
- Technical capabilities
- Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- AI inside the equipment
- AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.
- Wafer inspection coverage %
- Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.
- Operating wavelength nm
- Light wavelength of the named lithography or inspection tool.
- Target devices and applications
- Device types, materials or production uses the source states for the tool.
- Commercial or corporate status
- Dated product adoption, qualification or pending corporate transaction.