Semiconductor test equipment companies
7 of 48 companies sell test, probing or handling equipment, and 4 tie a named tool to AI or HBM devices. Advantest sells the V93000 EXA Scale for AI and HPC chips, Teradyne lists the Magnum 7H for HBM and DDR5 test, Cohu lists its Eclipse handler for GPUs and AI accelerators, FormFactor probes from -60 °C to +300 °C and ACCRETECH lists ±1.5 µm probing precision on its UF2000.
| Tools and product families | Target devices and applications | Alignment, overlay or probing accuracy | Process or test temperature°C | Automation and integration | AI-relevant tools (detail) | Customers | ||
|---|---|---|---|---|---|---|---|---|
| ACCRETECH (Tokyo Seimitsu) | AP3000/AP3000e production probers; UF2000 200 mm prober | — | UF2000 probing precision: ±1.5 µm | — | Prober factory integration supports SEMI GEM E30, CMS E87, PJ E40 and CJ E94 | — | — | 2026-11-11 |
| Advantest | V93000 EXA Scale | — | — | — | — | V93000 for AI and high-performance compute devices | IDMs, foundries and design houses | 2026-11-11 |
| Cohu | Eclipse handler | — | — | — | — | Eclipse for GPUs, CPUs, custom AI accelerators, network processors and ASICs | — | 2026-11-11 |
| FormFactor | CM300xi semi-/fully automated probe system | DC, AC and RF/microwave characterization, reliability, failure analysis and design debug | — | CM300xi full thermal option: -60°C to +300°C | Loader handles up to 25 or 50 wafers for unattended operation | — | — | 2026-11-11 |
| SEMES | LOTUS and BLUEICE PRIME cleaners; OMEGA-S/K tracks; Michelan O3/C4 etchers | — | — | — | — | — | Etch and overhead transport supplied to Samsung Electronics | 2026-11-11 |
| Teradyne | UltraFLEXplus; Magnum 7H; ETS-800 | Magnum 7H: HBM, DDR5 and next-generation AI memory production test | — | — | — | UltraFLEXplus for AI accelerators, custom ASICs and mobile SoCs | — | 2026-11-11 |
| Tokyo Electron | CLEAN TRACK LITHIUS Pro DICE coater/developer | LITHIUS Pro DICE supports EUV including High NA | — | — | — | Etch for logic/HBM interconnects; temporary wafer bonders/debonders for HBM | — | 2026-11-11 |
The tools behind each row
All 48 companiesHow to read the columns
Methodology- Tools and product families
- Named equipment models or product families supported by the cited vendor material.
- Target devices and applications
- Device types, materials or production uses the source states for the tool.
- Alignment, overlay or probing accuracy
- The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- Process or test temperature °C
- Temperature range or limit for the named equipment, with configuration qualifiers.
- Automation and integration
- Material handling, maintenance or factory interfaces supported by the cited model.
- AI-relevant tools (detail)
- The tool and the AI, HBM or data-center link, as the source states it.
- Customers
- Customer types or named customers in the source.