Axcelis Technologies

Makes ion implantation systems for semiconductor manufacturers. Its Purion H200 combines high-current implantation with medium-energy processing for silicon and silicon-carbide applications.

HQ US

Verified 11 Nov 2026

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Facts

Source per value

Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.: Ion implantation 1
HQ country Country of the corporate headquarters or principal corporate address stated by the company.: United States 3
Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.: Ion implantation 1
Tools and product families Named equipment models or product families supported by the cited vendor material.: Purion H200 1
Target devices and applications Device types, materials or production uses the source states for the tool.: Power devices, analog, BCD and mature-node devices 2
AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.: Not published
AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.: Not published
AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.: Not published
Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.: Purion H200: silicon 200/300; SiC 150/200 2
Operating wavelength nm Light wavelength of the named lithography or inspection tool.: Not published
Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.: Not published
Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.: Not published
Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.: Not published
Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.: Purion H200 implant energy range: 10–230 keV 1
Batch or chamber capacity Wafers per batch or process chambers, for the cited model.: Not published
Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.: Not published
Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.: Not published
Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.: Not published
Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.: Not published
Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.: US$839.0 million, 2025 5
Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.: Not published
Market-share basis Research provider, measurement basis and period behind the paired market-share figure.: Not published
Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.: Not published
Customers Customer types or named customers in the source.: Not published
Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.: Merger with Veeco pending; China SAMR clearance is the only regulatory approval outstanding; close expected by end of Q1 2027 (10-Q filed 2026-11-05) 4
Product launch Dated product announcement or sales launch, with context.: Not published
Headquarters Corporate headquarters or principal corporate address as the company states it.: Beverly, Massachusetts, United States 3

Sources

axcelis.com / medium energy accessed 2026-11-11
axcelis.com / Introducing the PurionH200 Single Wafer High Current Im accessed 2026-11-11
investor.axcelis.com / axcelis technologies and veeco instruments provide upda accessed 2026-11-11
Axcelis Form 10-Q, quarter to 30 Sep 2026 (SEC) accessed 2026-11-11
Axcelis Technologies Form 10-K (SEC) accessed 2026-11-11

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