Jusung Engineering

Makes semiconductor thin-film deposition equipment. Its ALD/CVD systems target advanced DRAM, 3D NAND, and logic devices, and its Eureka line provides epitaxy.

HQ KR Deposition

Verified 11 Nov 2026

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Facts

Source per value

Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.: Deposition and thermal 1
HQ country Country of the corporate headquarters or principal corporate address stated by the company.: South Korea 1
Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.: ALD, CVD and epitaxial deposition 1
Tools and product families Named equipment models or product families supported by the cited vendor material.: SDP System; Guidance Series; Eureka 1
Target devices and applications Device types, materials or production uses the source states for the tool.: Ultra-fine DRAM, 200-plus-layer 3D NAND and sub-10 nm logic 1
AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.: Not published
AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.: Not published
AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.: Not published
Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.: Not published
Operating wavelength nm Light wavelength of the named lithography or inspection tool.: Not published
Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.: Not published
Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.: Not published
Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.: Not published
Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.: Guidance Series adjusts step coverage and film stress 1
Batch or chamber capacity Wafers per batch or process chambers, for the cited model.: SDP System: five to six wafers simultaneously in one chamber 1
Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.: Vendor states ALD forms uniform thin films below 300°C 1
Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.: Not published
Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.: Not published
Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.: Not published
Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.: Not published
Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.: Not published
Market-share basis Research provider, measurement basis and period behind the paired market-share figure.: Not published
Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.: Not published
Customers Customer types or named customers in the source.: Not published
Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.: Not published
Product launch Dated product announcement or sales launch, with context.: Not published
Headquarters Corporate headquarters or principal corporate address as the company states it.: Gwangju, Gyeonggi-do, South Korea 1

Sources

jusung.com / semiconductor accessed 2026-11-11

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