Park Systems
Korean maker of atomic force microscopes. Its NX-Wafer is an automated in-line AFM for 300 mm fabs that runs defect review, CMP profiling and sub-angstrom roughness measurement.
Facts
Source per value- Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.
- Metrology and inspection 1
- HQ country Country of the corporate headquarters or principal corporate address stated by the company.
- South Korea 2
- Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.
- In-line atomic force microscopy metrology and automatic defect review 1
- Tools and product families Named equipment models or product families supported by the cited vendor material.
- Park NX-Wafer automated AFM 1
- Target devices and applications Device types, materials or production uses the source states for the tool.
- Automatic defect review and classification; CMP profiling of dishing, erosion and edge-over-erosion; sub-angstrom roughness 1
- AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.
- Not published
- AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.
- Not published
- AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.
- Not published
- Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.
- NX-Wafer automatic defect review: 300 1
- Operating wavelength nm Light wavelength of the named lithography or inspection tool.
- Not published
- Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.
- Not published
- Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- Not published
- Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.
- Not published
- Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- Noise floor below 0.5 Å; XY scan 100 × 100 µm; Z scan 15 µm, 30 µm optional 1
- Batch or chamber capacity Wafers per batch or process chambers, for the cited model.
- Not published
- Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.
- Not published
- Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.
- Not published
- Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.
- Not published
- Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.
- Automatic tip exchange (vendor-stated 99.9% success rate); EFEM or FOUP wafer handler 1
- Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.
- Not published
- Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.
- Not published
- Market-share basis Research provider, measurement basis and period behind the paired market-share figure.
- Not published
- Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.
- Not published
- Customers Customer types or named customers in the source.
- Not published
- Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.
- Not published
- Product launch Dated product announcement or sales launch, with context.
- Not published
- Headquarters Corporate headquarters or principal corporate address as the company states it.
- Not published
Sources
- Park NX-Wafer product page accessed 2026-11-11
- Park Systems headquarters expansion release (19 Sep 2023) accessed 2026-11-11
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