ASMPT
Makes semiconductor assembly equipment including precision die bonders and thermocompression systems. Its AMICRA NANO supports photonic assembly, while its broader packaging portfolio serves AI computing and HBM.
Facts
Source per value- Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.
- Packaging and assembly 1
- HQ country Country of the corporate headquarters or principal corporate address stated by the company.
- Singapore 3
- Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.
- Precision die attach and flip-chip bonding 1
- Tools and product families Named equipment models or product families supported by the cited vendor material.
- AMICRA NANO 1
- Target devices and applications Device types, materials or production uses the source states for the tool.
- Photonic assembly and AuSn eutectic bonding 1
- AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.
- Yes 2
- AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.
- TCB systems serve AI data-center packaging; memory-tool decisions linked to HBM4 rollouts (Q3 2026 disclosure) 2
- AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.
- Not published
- Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.
- Not published
- Operating wavelength nm Light wavelength of the named lithography or inspection tool.
- Not published
- Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.
- Not published
- Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- AMICRA NANO placement: ±0.2 µm at 3 sigma; performance depends on package and material 1
- Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.
- Not published
- Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- AMICRA NANO: 300 mm bonding station 1
- Batch or chamber capacity Wafers per batch or process chambers, for the cited model.
- Not published
- Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.
- Not published
- Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.
- Not published
- Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.
- Not published
- Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.
- Not published
- Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.
- Not published
- Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.
- Not published
- Market-share basis Research provider, measurement basis and period behind the paired market-share figure.
- Not published
- Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.
- Not published
- Customers Customer types or named customers in the source.
- Not published
- Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.
- Not published
- Product launch Dated product announcement or sales launch, with context.
- Not published
- Headquarters Corporate headquarters or principal corporate address as the company states it.
- Singapore 3
Sources
- semi.asmpt.com / amicra nano accessed 2026-11-11
- asmpt.com / asmpt q3 2026 investor presentation accessed 2026-11-11
- asmpt.com / e 00522ar 20250328 accessed 2026-11-11
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