Kulicke & Soffa
Makes semiconductor assembly equipment for chiplet and stacked-die packaging. Its APTURA thermocompression platform supports direct copper-to-copper bonding and development of bumpless chip-to-wafer interconnects.
Facts
Source per value- Process step The main fab or back-end step the company sells equipment for, our grouping of the process steps in its cited product material. "Several steps" means three or more.
- Packaging and assembly 1
- HQ country Country of the corporate headquarters or principal corporate address stated by the company.
- United States 2
- Process steps covered Manufacturing or test stages covered by the cited equipment; illustrative rather than an exhaustive company portfolio.
- Thermocompression bonding 1
- Tools and product families Named equipment models or product families supported by the cited vendor material.
- APTURA 1
- Target devices and applications Device types, materials or production uses the source states for the tool.
- Not published
- AI-relevant tools True where the vendor or its filings tie a named tool to AI, HBM or AI data-center chips. Empty means the link is not in our sources, not that none exists.
- Yes 1
- AI-relevant tools (detail) The tool and the AI, HBM or data-center link, as the source states it.
- Thermocompression chip-to-substrate equipment for AI and HPC chiplets and stacked dies 1
- AI inside the equipment AI or machine-learning functions the vendor describes in its inspection, metrology or equipment analytics. Not the same as chips made for AI.
- Not published
- Wafer or ingot diameters mm Model-specific diameters in mm. Crystal-growth entries refer to ingot diameter. Twelve-inch wafers are nominal 300 mm.
- Not published
- Operating wavelength nm Light wavelength of the named lithography or inspection tool.
- Not published
- Patterning resolution Model-specific resolution or minimum linewidth with the vendor’s qualifiers. Not interchangeable with a process-node label.
- Not published
- Alignment, overlay or probing accuracy The vendor’s own overlay, placement, alignment or probing metric with units and statistical definition. Metrics are not directly comparable across vendors.
- Not published
- Rated throughput Vendor-stated model throughput with units and test conditions; dry-cycle and maximum rates are labelled.
- Not published
- Technical capabilities Model-specific process ranges, configurations or capabilities. Comparative performance claims are attributed to the vendor.
- Direct copper-to-copper bonding is standard on APTURA 1
- Batch or chamber capacity Wafers per batch or process chambers, for the cited model.
- Not published
- Process or test temperature °C Temperature range or limit for the named equipment, with configuration qualifiers.
- Not published
- Substrate or die dimensions Model-specific substrate, panel or die dimensions and units.
- Not published
- Wafer inspection coverage % Inspection coverage the vendor states for the named capability. It is not a defect-detection rate.
- Not published
- Automation and integration Material handling, maintenance or factory interfaces supported by the cited model.
- Not published
- Annual revenue Total company revenue for the fiscal year named, from the annual filing or annual report, in the reporting currency. Includes any non-equipment segments the company has.
- US$654.1 million, fiscal 2025 (year to 4 Oct 2025) 3
- Market share or position Segment-specific share or ranking claim, with year and geography. Vendor claims are labelled as claims; segments are not comparable.
- Not published
- Market-share basis Research provider, measurement basis and period behind the paired market-share figure.
- Not published
- Installed base or shipments Dated cumulative shipments disclosed by the vendor. Shipments are not necessarily active installed systems.
- Not published
- Customers Customer types or named customers in the source.
- Not published
- Commercial or corporate status Dated product adoption, qualification or pending corporate transaction.
- Bumpless chip-to-wafer hybrid bonding demonstrated with collaborators; announced 2024-08-07 1
- Product launch Dated product announcement or sales launch, with context.
- Not published
- Headquarters Corporate headquarters or principal corporate address as the company states it.
- Fort Washington, Pennsylvania, United States; Singapore 2
Sources
- investor.kns.com / 2024 08 07 Kulicke Soffa Announces Thermo Compression A accessed 2026-11-11
- kns.com / sustainability report 2024 accessed 2026-11-11
- Kulicke & Soffa Form 10-K (SEC) accessed 2026-11-11
Get a quote from Kulicke & Soffa and similar companies
Tell us what you need once. We send it to matching companies and they reply to you directly.